First level interconnection based on optimization of Cu stud bump for chip to chip package
Journal
AIP Conference Proceedings
ISSN
0094-243X
Date Issued
2018
Author(s)
Mary Rose Lim
University of Southern Mindanao
Hanizah Aris
Vithyacharan Retnasamy
Edward W.C.L.
Kesvakumar Muniandy
Najeeba Khan
C. S. Foong
DOI
10.1063/1.5080908
Handle (URI)
File(s)