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  5. Wettability of Sn-3.0Ag-0.5Cu solder reinforced with TiO2 and Al2O3 nanoparticles at different reflow times
 
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Wettability of Sn-3.0Ag-0.5Cu solder reinforced with TiO2 and Al2O3 nanoparticles at different reflow times

Journal
Nanomaterials
ISSN
2079-4991
Date Issued
2023
Author(s)
Nur Haslinda Mohamed Muzni
Multimedia University
Ervina Efzan Mhd Noor
Multimedia University
Mohd. Mustafa Al Bakri Abdullah
Universiti Malaysia Perlis
DOI
10.3390/nano13202811
Abstract
This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO2 and Al2O3 nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance
Subjects
  • Nanoparticles

  • Wettability

  • Nanocomposite

File(s)
Wettability of Sn-3.0Ag-0.5Cu solder reinforced with TiO2 and Al2O3 nanoparticles at different reflow times.pdf (3.79 MB)
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