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Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint

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cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Faculty of Electronic Engineering & Technology
cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department e623d35c-7319-44e9-9272-69c76a19a9c4
cris.virtualsource.department b818f9b7-a3ab-438f-bd2c-40cf513d8798
cris.virtualsource.department cd3c50ac-9fed-4851-b963-ce39c9907b01
cris.virtualsource.department dddac5f4-97ee-45b9-a38a-4bf759a9c138
dc.contributor.author Aimi Noorliyana Hashim
dc.contributor.author Mohd Arif Anuar Mohd Salleh
dc.contributor.author Andrei Victor Sandu
dc.contributor.author Muhammad Mahyiddin Ramli
dc.contributor.author Khor Chu Yee
dc.contributor.author Noor Zaimah Mohd Mokhtar
dc.contributor.author Jitrin Chaiprapa
dc.date.accessioned 2024-06-20T03:12:25Z
dc.date.available 2024-06-20T03:12:25Z
dc.date.issued 2021
dc.description.abstract The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
dc.identifier.doi 10.3390/ma14040738
dc.identifier.uri https://www.mdpi.com/1996-1944/14/4/738/pdf
dc.identifier.uri https://www.mdpi.com/journal/materials
dc.identifier.uri https://hdl.handle.net/20.500.14170/3028
dc.language.iso en
dc.relation.ispartof Materials
dc.relation.issn 1996-1944
dc.subject Sn whisker
dc.subject Reliability
dc.subject Lead-free solder
dc.subject Sn-0.7Cu-0.05Ni
dc.subject Whisker growth
dc.subject Mitigation
dc.subject Interconnects
dc.subject Soldering
dc.title Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint
dc.type journal-article
dspace.entity.type Publication
oaire.citation.endPage 15
oaire.citation.issue 4
oaire.citation.startPage 1
oaire.citation.volume 14
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Faculty of Electronic Engineering & Technology
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation 111 University Avenue
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