Publication:
Effect of Ni on the formation and growth of primary Cu₆Sn₅ intermetallics in Sn-0.7 wt.%Cu solder pastes on Cu substrates during the soldering process
Effect of Ni on the formation and growth of primary Cu₆Sn₅ intermetallics in Sn-0.7 wt.%Cu solder pastes on Cu substrates during the soldering process
| dc.contributor.author | M.A.A. Mohd Salleh | |
| dc.contributor.author | S.D. McDonald | |
| dc.contributor.author | C.M. Gourlay | |
| dc.contributor.author | S.A. Belyakov | |
| dc.contributor.author | H. Yasuda | |
| dc.contributor.author | K. Nogita | |
| dc.date.accessioned | 2024-05-18T14:25:19Z | |
| dc.date.available | 2024-05-18T14:25:19Z | |
| dc.date.issued | 2015 | |
| dc.description.abstract | This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu₆Sn₅ in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu₆Sn₅ intermetallics, making them small. In contrast, without Ni, primary Cu₆Sn₅ intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu₆Sn₅. The results provide direct evidence of the sequence of events in the reaction of Nicontaining Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu₆Sn₅ intermetallic | |
| dc.identifier.doi | 10.1007/s11664-015-4121-x | |
| dc.identifier.doi | https://link.springer.com/journal/11664 | |
| dc.identifier.uri | https://link.springer.com/article/10.1007/s11664-015-4121-x | |
| dc.identifier.uri | https://hdl.handle.net/20.500.14170/2687 | |
| dc.language.iso | en | |
| dc.relation.ispartof | Journal of Electronic Materials | |
| dc.relation.issn | 0361-5235 | |
| dc.relation.issn | 1543-186X | |
| dc.title | Effect of Ni on the formation and growth of primary Cu₆Sn₅ intermetallics in Sn-0.7 wt.%Cu solder pastes on Cu substrates during the soldering process | |
| dc.type | journal-article | |
| dspace.entity.type | Publication | |
| oaire.citation.endPage | 13 | |
| oaire.citation.issue | 1 | |
| oaire.citation.startPage | 1 | |
| oaire.citation.volume | 45 | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | The University of Queensland | |
| oairecerif.author.affiliation | Imperial College | |
| oairecerif.author.affiliation | Imperial College | |
| oairecerif.author.affiliation | Kyoto University | |
| oairecerif.author.affiliation | The University of Queensland |
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