This paper reported an example of a light-emitting diode (LED) failure with vertical chip crack, proposed an evidence method to identify the crack initiation zone and interpreted the fracture feature to understand the crack direction. Fractography by Secondary Electron Microscopy (SEM) imaging was employed to visualize the fracture features. It has demonstrated the century-old method used to study fracture surface of metallic and ceramic materials is still presently relevant in the age of semiconductor.
