Zaliman Sauli
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Preferred name
Zaliman Sauli
Official Name
Zaliman, Sauli
Alternative Name
Sauli, Zaliman B.
Sauli, Zaliman
Sauli, Z.
Main Affiliation
Scopus Author ID
24554644300
Researcher ID
FWC-2779-2022

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The influence of selenium amount added into the graphite box during the selenization of solution deposited CIGSe thin films.

2021 , G M Albalawneh , M M Ramli , M ZM Zain , Zaliman Sauli

AbstractCu(In,Ga)Se2 (CIGSe) semiconductor is an efficient light absorber material for thin-film solar cell technology. The sequential evaporation of precursor solution, followed by the selenization process, is a promising non-vacuum and low-cost approach for CIGSe thin-film fabrication. The main properties of CIGSe thin films are strongly affected by the post-selenization step. Hence, thorough control of selenization parameters is essential for achieving pure crystalline, large grain films needed for high-performance solar cell devices. In this study, the impact of selenium (Se) amount added during the selenization step was evaluated. The structural, morphological, and compositional properties of the selenized thin films were investigated. The CIGSe precursor film was deposited by a spin-coating technique using a thiol/amine-based solution, followed by annealing with different Se amounts (100, 200, and 300 mg) within a partially closed small round graphite container. In all cases, uniform films of 1.2–1.5 µm thickness with a well-defined single chalcopyrite phase were obtained. It was observed that the grain size and Se content increased with increasing Se mass added. Moreover, the sample selenized with 200 mg Se resulted in higher surface coverage, thinner fine-grained layer, and less MoSe2 formation than the excess Se samples.

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Kinetics, mass transport characteristics, and structural changes during air-drying of purple yam (Dioscorea Alata L.) at different process conditions

2017 , Flordeliza C. De Vera , Leif Anthony B. Comaling , Iya Ray Alyanna M. Lao , Alvin R. Caparanga , Zaliman Sauli

This experiment was designed to follow the 2k factorial design to study the effects of the three drying parameters on the drying characteristics and effective moisture diffusivity and to fit each run performed on the best thin-layer drying kinetics model. Raw purple yam samples were pre-treated and undergone the designed drying procedures at which the weight of the samples were recorded every minute until such time that the sample weights become constant. Scanning Electron Microscopy (SEM) is utilized for qualitative analysis of the dried samples. The number of pores per unit area and the overall aesthetics of the surface of the dried samples were compared also using SEM. Considering the qualitative analysis conducted on the samples from the images of SEM, dried samples from run 2 has the most desirable conditions such as high temperature and low air velocity for drying because the samples from this run have large pore diameters with minimal cell breakages.

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Breast surface variation phase map analysis with digital fringe projection

2019 , Wan Mokhzani Wan Norhaimi , Zaliman Sauli , Hasnizah Aris , Mukhzeer Mohamad Shahimin , MAM Azmi , Wong, K. , Vithyacharan Retnasamy , Rajendaran Vairavan , Christopher R. Valenta , Masafumi Kimata

Breast carcinoma has become one of the most frequently diagnosed life threatening cancer among women. Early detection of breast cancer is highly essential with the aid of non-contact imaging modalities. Recently, non-contact breast imaging methods based on fringe projection has been developed for breast surface change inspection. In this work, a non-contact digital fringe projection imaging modality that utilizes phase shifting fringe patterns for identifying surface changes has been developed for investigating breast surface changes caused by the presence of tumors. A medical grade prosthetic breast was used as the experimental subject and subjugated to breast changes through the enlargement of a round shaped silicon catheter as a tumor. The fringes were projected onto the breast surface based on the three steps phase shift fringe projection. The fringe patterns consisted of a large fringe width to enable the breast image to be confined in fewer fringe patterns. A resulting phase map was obtained where pixel coordinate marking was conducted on the phase map breast image. Each of the pixel’s coordinate was compared to identify the location of the surface changes. A range of 2-9 pixel coordinate shifts from the 0.5 – 2 cm tumor growth were obtained from the results which demonstrated the capability of using phase map analysis from digital fringe projection in identifying surface changes of the women’s breast.

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Determination of drying kinetics and sorption isotherm of black pepper (Piper Nigrum)

2017 , Flordeliza C. De Vera , Vanessa Bernadette B. Atienza , Jomicah B. Capili , Zaliman Sauli , Mohamad Halim Abd. Wahid

In the present study of food products, determination of the drying characteristics of black pepper using an oven is not yet completely established. This study aimed to determine the drying kinetics and sorption isotherm of black pepper using a convective oven at 30°C, 40°C and 50°C. The data gathered in this study were used to fit in selected mathematical models for drying kinetics and sorption isotherm. Among these models, the Midilli model (MR=0.5338exp(0.7273t-0.0551)+-0.0005t for 30°C, MR=0.5814exp(0.6293t-0.0764)+ -0.0008t for 40°C and MR=0.3187exp(1.1777t-0.0466)+ -0.0011t for 50°C) was the best fit to explain the moisture transfer in black pepper, while the GAB Model (m/0.1302=((0.1906)( 0.7811)aw)/(1-(0.7811)aw)[1-(0.7811)aw+(0.1906)( 0.7811)aw])) was for the equilibrium moisture content and water activity relationship. After evaluating the data, the drying characteristics of black pepper at 40°C yielded better results than 30°C and 50°C. XLSTAT and ANOVA Add-in of Microsoft Excel was the software used to compute for the necessary values in the assessment of the mathematical models for this study.

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Kinetics, mass transport characteristics, and structural changes during air-drying of purple yam (Dioscorea Alata L.) at different process conditions

2017 , Flordeliza C. De Vera , Leif Anthony B. Comaling , Iya Ray Alyanna M. Lao , Alvin R. Caparanga , Zaliman Sauli

This experiment was designed to follow the 2k factorial design to study the effects of the three drying parameters on the drying characteristics and effective moisture diffusivity and to fit each run performed on the best thin-layer drying kinetics model. Raw purple yam samples were pre-treated and undergone the designed drying procedures at which the weight of the samples were recorded every minute until such time that the sample weights become constant. Scanning Electron Microscopy (SEM) is utilized for qualitative analysis of the dried samples. The number of pores per unit area and the overall aesthetics of the surface of the dried samples were compared also using SEM. Considering the qualitative analysis conducted on the samples from the images of SEM, dried samples from run 2 has the most desirable conditions such as high temperature and low air velocity for drying because the samples from this run have large pore diameters with minimal cell breakages.

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Simulation of The Impact of Bulk Selenium Composition Variation in CIGSSe Solar Cell

2022 , G.M. Albalawneh , M.M. Ramli , M.Z.M. Zain , Zaliman Sauli , M. Nabiałek , K. Jeż

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High power LED heat dissipation analysis via copper diamond slug

2013 , Rajendaran Vairavan , Zaliman Sauli , Vithyacharan Retnasamy , Kamarudin Hussin

The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances of the LEDs are dependent on the junction temperature as it is inherited high heat production. Hence, proper evaluation of the junction temperature is very significant. In this paper, the heat dissipation of single chip high power LED attached to copper diamond based cylindrical heat slug was scrutinized through simulation. The heat dissipation was characterized in terms of junction temperature. In addition, the stress of the LED chip is evaluated with varied input power. Ansys version 11 was used for the simulation. The simulated results reveal that at input power of 1 W, the max junction temperature of the LED is 114.69°C.

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Thermosonic vs thermocompression flip chip bonding for low cost system in package

2018 , M. R. Lim , Zaliman Sauli , Hanizah Aris , V. Retnasamy , Edward W.C.L. , K. Muniandy , N. Khan , C. S. Foong

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Development of copper busbar by silver plating under non-linear load operation using finite element method (FEM)

2023-04 , Muhammad Hafiz Ab Aziz , Muhammad Mokhzaini Azizan , Zaliman Sauli , Mohd Wafiuddin Yahya

Generally, busbars are used in electrical transmission and distribution power. The presence of harmonic current in the busbar will generate more heat to the system. The generation of heat will be increasing power losses at the busbar and reduced their conductivity. A three-dimensional (3D) Finite Element Method (FEM) by COMSOL Multiphysics software was used in this research to analyze the heat distribution, average temperature, and power losses of copper busbar with 0.5 mm silver plating on their surface. The dimension of 30 mm × 4 mm × 500 mm copper busbar was utilized based on their suitable current carrying capacity from the measured location. The current source starts from 419 A and varies from 0% until 50% of Total Harmonic Distortion (THD) with an interval of 5%. The findings show improvement condition of copper busbar after silver plated on their surface. The bare copper busbar only meets the requirement range condition of BS159:1992 until the existence of 15% Total Harmonic Distortion of current (THDi) component while silver-plated copper complies until the maximum value of THDi which is 50%.

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Reliability comparison between solder and solderless flip chip interconnection in terms of high temperature storage

2020-01-08 , Rong L.M. , Zaliman Sauli , Aris H. , Retnasamy V.

Flip chip (FC) has been used to replace wire bond due to its better performance. The 1st interconnection in FC plays an important role in terms of reliability study. Au/Cu stud bump capped with Sn tends to have Kirkendall void in the joint which can cause open circuit. This paper focuses on depth analysis on solderless chip bumping by using only Cu stud bump in the chip on chip (CoC) ball grid array (BGA) package. High temperature storage 150 °C has been applied on package and the result was compared with those the use of Au stud bump capped with Sn. The result shows that Cu stud bump has a better reliability in term of electrical resistance compared with Au stud bump capped with Sn. Therefore, solderless chip bumping has the potential to replace Au stud bump capped with Sn for FC BGA package.

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