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Zaliman Sauli
Preferred name
Zaliman Sauli
Official Name
Zaliman, Sauli
Alternative Name
Sauli, Zaliman B.
Sauli, Zaliman
Sauli, Z.
Main Affiliation
Scopus Author ID
24554644300
Researcher ID
FWC-2779-2022
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1 - 3 of 3
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PublicationDigital fringe projection system for round shaped breast tumor detection( 2020-01-01)
;Norhaimi W.M.W. ;Aris H. ;Retnasamy V. ;Vairavan R.Aziz M.H.A.The digital fringe projection has been widely used in the field of surface imaging however its application in the field of body imaging especially for human breasts is still quite limited. Currently, the common imaging modality for breast tumor diagnoses are breast ultrasound and mammogram. There are advantages and limitations of using the mammogram and ultrasound in terms of the procedure of the process and the non-invasive nature of the procedure. In this work, an automated digital fringe projection system is developed to execute the imaging of surface changes of a helical shaped phantom breast. The fringe projection setup utilizes a computer, LCD projector, and a CCD camera. The tumor used was round-shaped with a diameter size of 1.5 and 2 cm. The fringe pattern was projected through the three-step phase shift where a resulting phase map was obtained. Results demonstrated that the system was able to identify an average pixel shift of five and ten on the breast surface caused by the presence of the round breast tumors.1 -
PublicationReliability comparison between solder and solderless flip chip interconnection in terms of high temperature storage( 2020-01-08)
;Rong L.M. ;Aris H.Retnasamy V.Flip chip (FC) has been used to replace wire bond due to its better performance. The 1st interconnection in FC plays an important role in terms of reliability study. Au/Cu stud bump capped with Sn tends to have Kirkendall void in the joint which can cause open circuit. This paper focuses on depth analysis on solderless chip bumping by using only Cu stud bump in the chip on chip (CoC) ball grid array (BGA) package. High temperature storage 150 °C has been applied on package and the result was compared with those the use of Au stud bump capped with Sn. The result shows that Cu stud bump has a better reliability in term of electrical resistance compared with Au stud bump capped with Sn. Therefore, solderless chip bumping has the potential to replace Au stud bump capped with Sn for FC BGA package.1 -
PublicationFringe projection phase shift variance effects on breast height imaging( 2020-01-08)
;Norhaimi W.M.W. ;Aris H. ;Retnasamy V.Vairavan R.Fringe projection has been garnering tremendous interest in the field of optical imaging. A wide range of surface measurement application including the medical application utilizes the fringe projection as means of surface metrology due to its non-invasive imaging modality. Although fringe projection has been applied in the medical field, minimal work has been conducted in the field of breast height imaging. In this work, a digital fringe projection system based on the phase shifting fringe projection is applied on a prosthetic tear drop breast. The fringe projection system consists of a digital projector, CCD camera and a computer. A phase shift variance of π/4, π/2 and 2π/3 from the fringe patterns are projected onto the breast sample using the three step phase shift fringe projection. The phase shift is varied to determine a suitable phase shift for the tear drop breast height imaging obtained from the phase map followed by the phase unwrapping process. The surface height profile obtained from the varied phase shift of the fringe projection system was compared to the height profile of the tear drop breast obtained from a direct method using the electronic digital vernier caliper. The results demonstrate that the fringe patterns phase shifted by 2π/3 produce a smooth phase map and unwrapped phase map which resulted in a clear and visible height profile of the tear drop breast with an almost identical height profile with the direct measurement method. The preliminary results from this study can be further extended to breast imaging with the presence of cancerous breast tumors.2