Muhammad Firdaus Mohd Nazeri
Thumbnail Image
Preferred name
Muhammad Firdaus Mohd Nazeri
Official Name
Muhammad Firdaus , Mohd Nazeri
Alternative Name
Nazeri, Muhammad Firdaus Mohd
Nazeri, M. F.M.
Nazeri, M. F.Mohd
Nazeri, Muhammad Firdaus
Main Affiliation
Scopus Author ID
55206645000
Researcher ID
C-8522-2019

Research Output
Now showing 1 - 1 of 1
  • Publication
    Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO₂ composite solder alloy after selective electrochemical etching
    (IOP Publishing, 2020-01)
    Muhamad Zamri Yahaya
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Soorathep Kheawhom
    ;
    Balázs Illés
    ;
    Agata Skwarek
    ;
    Ahmad Azmin Mohamad
    This work aims to provide deep morphological observation on the incorporated TiO₂ nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of-350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO₂ near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO₂ nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO₂ nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO₂ content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO₂ reinforcement particles.