Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output

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Tin whiskers formation in Sn₀.₇Cu₀.₀₅Ni₁.₅Bi under electro-migration stressing

2020 , N.Z.M. Mokhtar , Mohd Arif Anuar Mohd Salleh , G.M. Zhang , D.M. Harvey , M. Nabialek , Aimi Noorliyana Hashim , S.F. Nazri

Stress induced by electrical current testing indeed has caused the formation of many whiskers growth in soldering applications. The aim of this investigation is to investigate the electrical current testing to the formation of whiskers. Also the mitigation could be achieved with the additional element of Nickel-Bismuth (Ni–Bi). Characterization of whisker growths are evaluated using the Scanning Electron Microscopy (SEM) on the deposits near anode and cathode areas. Synchrotron micro-XRF were performed on Sn₀.₇Cu₀.₀₅Ni₁.₅Bi at anode and cathode to accurately observe the distributions of elements in the sample. The obtained results demonstrate that the whisker growths with the effect of current stressing is associated with the intermetallic compound (IMCs) thickness on the anode and cathode areas. Finding shows that by addition of Ni-Bi elements can help to reduce the amount of whiskers form by refining the IMCs formation.

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Formation and growth of intermetallic compounds in lead-free solder joints: a review

2022 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Mohd. Mustafa Al Bakri Abdullah , Nur Syahirah Mohamad Zaimi , Andrei Victor Sandu , Petrica Vizureanu , Adam Rylski , Siti Farahnabilah Muhd Amli

Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

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The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings

2019 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , P. Narayanan , Mohd. Mustafa Al Bakri Abdullah , J. Chaiprapa , Rita Mohd Said , S. Yoriya , K. Nogita

The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7Cu solder alloy results in an improvement in the wettability based on dipping tests. The solderability investigation using a globule mode shows the influence of Ni and Bi on the interfacial intermetallic compound (IMC). The addition of Ni to a Sn-0.7Cu solder coating resulted in a (Cu,Ni)6Sn5 interfacial IMC, which enhanced the solderability performance during the globule test. With an increasing amount of Bi in the Sn-0.7Cu-0.05Ni-xBi solder ball, the surface energy of the solder alloy can be reduced, and this improves the solderability. The synchrotron micro-XRF results indicate that Ni is found in a relatively high concentration in the interfacial layer. Additionally, Bi was found to be homogenously distributed in the bulk solder, which improved solderability.

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Influence of 1.5 wt.% Bi on the microstructure, hardness, and shear strength of Sn-0.7Cu solder joints after isothermal annealing

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Siti Farahnabilah Muhd Amli , Rita Mohd Said , Norainiza Saud , Mohd. Mustafa Al Bakri Abdullah , Petrica Vizureanu , Adam Rylski , Jitrin Chaiprapa , Marcin Nabialek

This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth’s activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol−1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.

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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Rita Mohd Said , Mohd. Mustafa Al Bakri Abdullah , Dewi Suriyani Che Halin , Norainiza Saud , Marcin Nabiałek

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

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Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

2022 , Siti Faqihah Roduan , Juyana A. Wahab , Mohd Arif Anuar Mohd Salleh , Nurul Aida Husna Mohd Mahayuddin , Mohd. Mustafa Al Bakri Abdullah , Aiman Bin Mohd Halil , Amira Qistina Syamimi Zaifuddin , Mahadzir Ishak Muhammad , Andrei Victor Sandu , Mădălina Simona Baltatu , Petrica Vizureanu

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.

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