Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 6 of 6
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Publication

Investigations of infrared desktop reflow oven with FPCB Substrate during reflow soldering process

2021 , Muhammad Iqbal Ahmad , Mohd Sharizal Abdul Aziz , Mohd Zulkifly Abdullah , Mohd Arif Anuar Mohd Salleh , Mohammad Hafifi Hafiz Ishak , Wan Rahiman , Marcin Nabiałek

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.

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Influence of 1.5 wt.% Bi on the microstructure, hardness, and shear strength of Sn-0.7Cu solder joints after isothermal annealing

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Siti Farahnabilah Muhd Amli , Rita Mohd Said , Norainiza Saud , Mohd. Mustafa Al Bakri Abdullah , Petrica Vizureanu , Adam Rylski , Jitrin Chaiprapa , Marcin Nabialek

This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth’s activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol−1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.

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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Rita Mohd Said , Mohd. Mustafa Al Bakri Abdullah , Dewi Suriyani Che Halin , Norainiza Saud , Marcin Nabiałek

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

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Microstructure evolution of Ag/TiO2 thin film

2021 , Dewi Suriyani Che Halin , Kamrosni Abdul Razak , Mohd Arif Anuar Mohd Salleh , Mohd Izrul Izwan Ramli , Mohd. Mustafa Al Bakri Abdullah , Ayu Wazira Azhari , Kazuhiro Nogita , Hideyuki Yasuda , Marcin Nabiałek , Jerzy J. Wysłocki

Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO2 thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO2 thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO2 also increased in terms of area and the number of junctions. The growth rate of Ag/TiO2 at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.

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Microstructural studies of Ag/TiO2 thin film; effect of annealing temperature

2021 , Kamrosni Abdul Razak , C.H. Dewi Suryani , A. Azliza , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Norsuria Mahmed , V. Chobpattana , L. Kaczmarek , B. Jeż , M. Nabiałek

Microstructures are an important link between materials processing and performance, and microstructure control is essential for any materials processing route where the microstructure plays a major role in determining the properties. In this work, silverdoped titanium dioxide (Ag/TiO2) thin film was prepared by the sol-gel method through the hydrolysis of titanium tetra-isopropoxide and silver nitrate solution. The sol was spin coated on ITO glass substrate to get uniform film followed by annealing process for 2 hours. The obtained films were annealed at different annealing temperatures in the range of 300°C-600°C in order to observe the effect on crystalline state, microstructures and optical properties of Ag/TiO2 thin film. The thin films were characterized by X-Ray diffraction (XRD), scanning electron microscopy (SEM), and UV-Vis spectrophotometry. It is clearly seen, when the annealing temperature increases to 500°C, a peak at 2θ = 25.30° can be seen which refers to the structure of TiO2 tetragonal anatase. The structure of Ag/TiO2 thin film become denser, linked together, porous and uniformly distributed on the surface and displays the highest cut-off wavelength value which is 396 nm with the lowest band gap value, which is 3.10 eV. Keywords: Ag/TiO2; Annealing Temperature; Microstructure; Optical Properties; Thin Film

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Characterization of SnOâ‚‚/TiOâ‚‚ with the addition of Polyethylene Glycol via sol-gel method for self-cleaning application

2023 , Dewi Suriyani Che Halin , A. Azliza , Kamrosni Abdul Razak , V. Chobpattana , Mohd Arif Anuar Mohd Salleh , Juyana A. Wahab , Mohd Mustafa Albakri Abdullah , L. Kaczmarek , M. Nabiałek , B. Jeż

TiO₂ is one of the most widely used metal oxide semiconductors in the field of photocatalysis for the self-cleaning purpose to withdraw pollutants. Polyethylene glycol (PEG) is recommended as a stabilizer and booster during preparation of water-soluble TiO₂. Preparation of SnO₂/TiO₂ thin film deposition on the surface of ceramic tile was carried out by the sol-gel spin coating method by adding different amount of PEG (0g, 0.2g, 0.4g, 0.6g, 0.8g) during the preparation of the sol precursor. The effects of PEG content and the annealing temperature on the phase composition, crystallite size and the hydrophilic properties of SnO₂/TiO₂ films were studied. The X-ray diffraction (XRD) spectra revealed different phases existed when the films were annealed at different annealing temperatures of 350°C, 550°C and 750°C with 0.4 g of PEG addition. The crystallite sizes of the films were measured using Scherrer equation. It shows crystallite size was dependent on crystal structure existed in the films. The films with mixed phases of brookite and rutile shows the smallest crystallite size. In order to measure the hydrophilicity properties of films, the water contact angles for each film with different content of PEG were measured. It can be observed that the water contact angle decreased with the increasing of the content of PEG. It shows the superhydrophilicity properties for the films with the 0.8 g of PEG annealed at 750°C. This demonstrates that the annealed temperature and the addition of PEG affect the phase composition and the hydrophilicity properties of the films

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