Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 7 of 7
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Publication

Microstructure evolution of Ag/TiO₂ thin film

2021 , Dewi Suriyani Che Halin , Kamrosni Abdul Razak , Mohd Arif Anuar Mohd Salleh , Mohd Izrul Izwan Ramli , Mohd. Mustafa Al Bakri Abdullah , Ayu Wazira Azhari , Kazuhiro Nogita , Hideyuki Yasuda , Marcin Nabiałek , Jerzy J. Wysłocki

Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO₂ thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO₂ thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO₂ also increased in terms of area and the number of junctions. The growth rate of Ag/TiO₂ at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.

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Contribution of interfacial bonding towards geopolymers properties in geopolymers reinforced fibers: A review

2022 , Muhd Hafizuddin Yazid , Meor Ahmad Faris bin Meor Ahmad Tajudin , Mohd. Mustafa Al Bakri Abdullah , Marcin Nabiałek , Shayfull Zamree Abd. Rahim , Mohd Arif Anuar Mohd Salleh , Marwan Kheimi , Andrei Victor Sandu , Adam Rylski , Bartłomiej Jeż

There is a burgeoning interest in the development of geopolymers as sustainable construction materials and incombustible inorganic polymers. However, geopolymers show quasi-brittle behavior. To overcome this weakness, hundreds of researchers have focused on the development, characterization, and implementation of geopolymer-reinforced fibers for a wide range of applications for light geopolymers concrete. This paper discusses the rapidly developing geopolymer-reinforced fibers, focusing on material and geometrical properties, numerical simulation, and the effect of fibers on the geopolymers. In the section on the effect of fibers on the geopolymers, a comparison between single and hybrid fibers will show the compressive strength and toughness of each type of fiber. It is proposed that interfacial bonding between matrix and fibers is important to obtain better results, and interfacial bonding between matrix and fiber depends on the type of material surface contact area, such as being hydrophobic or hydrophilic, as well as the softness or roughness of the surface.

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Publication

Microstructure evolution of Ag/TiO2 thin film

2021 , Dewi Suriyani Che Halin , Kamrosni Abdul Razak , Mohd Arif Anuar Mohd Salleh , Mohd Izrul Izwan Ramli , Mohd. Mustafa Al Bakri Abdullah , Ayu Wazira Azhari , Kazuhiro Nogita , Hideyuki Yasuda , Marcin Nabiałek , Jerzy J. Wysłocki

Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO2 thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO2 thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO2 also increased in terms of area and the number of junctions. The growth rate of Ag/TiO2 at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.

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Publication

Investigations of infrared desktop reflow oven with FPCB Substrate during reflow soldering process

2021 , Muhammad Iqbal Ahmad , Mohd Sharizal Abdul Aziz , Mohd Zulkifly Abdullah , Mohd Arif Anuar Mohd Salleh , Mohammad Hafifi Hafiz Ishak , Wan Rahiman , Marcin Nabiałek

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.

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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Rita Mohd Said , Mohd. Mustafa Al Bakri Abdullah , Dewi Suriyani Che Halin , Norainiza Saud , Marcin Nabiałek

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

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Publication

Contribution of interfacial bonding towards geopolymers properties in geopolymers reinforced fibers: a review

2022 , Muhd Hafizuddin Yazid , Meor Ahmad Faris bin Meor Ahmad Tajudin , Mohd. Mustafa Al Bakri Abdullah , Marcin Nabiałek , Shayfull Zamree Abd. Rahim , Mohd Arif Anuar Mohd Salleh , Marwan Kheimi , Andrei Victor Sandu , Adam Rylski , Bartłomiej Jeż

There is a burgeoning interest in the development of geopolymers as sustainable construction materials and incombustible inorganic polymers. However, geopolymers show quasi-brittle behavior. To overcome this weakness, hundreds of researchers have focused on the development, characterization, and implementation of geopolymer-reinforced fibers for a wide range of applications for light geopolymers concrete. This paper discusses the rapidly developing geopolymer-reinforced fibers, focusing on material and geometrical properties, numerical simulation, and the effect of fibers on the geopolymers. In the section on the effect of fibers on the geopolymers, a comparison between single and hybrid fibers will show the compressive strength and toughness of each type of fiber. It is proposed that interfacial bonding between matrix and fibers is important to obtain better results, and interfacial bonding between matrix and fiber depends on the type of material surface contact area, such as being hydrophobic or hydrophilic, as well as the softness or roughness of the surface.

View
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Publication

The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn Solder Joint

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Rita Mohd Said , Marcin Nabiałek , Mohd. Mustafa Al Bakri Abdullah , Norainiza Saud , Dewi Suriyani Che Halin

The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

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