Marliza Mostapha @ Zakaria
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Marliza Mostapha @ Zakaria
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Marliza, Mostapha @ Zakaria
Alternative Name
Mostapha, Marliza
Mostapha, M.
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Scopus Author ID
57210920844
Researcher ID
AAL-1894-2020

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Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique

2024-12 , Juyana A. Wahab , Mohd Arif Anuar Mohd Salleh , Marliza Mostapha @ Zakaria , Muhammad Firdaus Mohd Nazeri , Nurul Aida Husna Mohd Mahayuddin , Siti Faqihah Roduan

The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.

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Void distributions in Sn-3.0Ag-0.5Cu (SAC305) composite lead free solder subjected to thermal ageing using acoustic micro imaging technique

2020 , Nur Syahirah Mohamad Zaimi , Mohd Arif Anuar Mohd Salleh , Mohd. Mustafa Al Bakri Abdullah , Marliza Mostapha @ Zakaria , M S Baltatu , R Badlishah Ahmad

The formations of the voids in SAC305 lead free solder and SAC305 with additions of kaolin geopolymer ceramics were studied. The composite solders were fabricated by using powder metallurgy with microwave sintering method. The samples were sandwiched between two copper substrates and reflowed in a reflow oven and aged at 125°C for 0 and 7 days. The acoustic micro imaging was used to analyse the distributions of voids in the solder joints of SAC305 and SAC305 with additions of kaolin geopolymer ceramics. Results shows that, rhe void in SAC305 are larger in size and numbers as compared to SAC305 with additions of kaolin geopolymer ceramics for both reflowed and aged conditions.

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Impact of thermal ageing and multiple reflow on lead free composite solder : a short review

2020 , Nur Syahirah Mohamad Zaimi , Mohd Arif Anuar Mohd Salleh , Mohd. Mustafa Al Bakri Abdullah , Marliza Mostapha @ Zakaria , Romisuhani Ahmad

This paper reviews the impact of the thermal ageing and multiple reflow to the intermetallic compound (IMC) layer and mechanical performance of lead free solder reinforced with various reinforcements. Based on available literatures it had been proved that, the IMC layer and mechanical properties can be affected with the exposure of different temperatures and time. Besides that, the incorporation of the reinforcement in the matrix of solder alloys could improve the thickness of IMC layer and strength of the solder joints although it had been subjected to thermal ageing and multiple reflow cycles as compared to unreinforced solder. Therefore, the composite solder system could be possibly applied and adapted in current electronic devices even with the exposure of high temperatures.

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