Khor Chu Yee
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Preferred name
Khor Chu Yee
Official Name
Khor, Chu Yee
Alternative Name
Yee, Khor Chu
Khor, Chu Yee
Khor, C. Y.
Yee, K. C
Main Affiliation
Scopus Author ID
57193315174
Researcher ID
B-1541-2014

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  • Publication
    A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor
    (Elsevier, 2023)
    Mark Selvan
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Kok Hwa Yu
    ;
    Mohd Sharif Nurulakmal
    ;
    Heng Pin Ong
    ;
    Khor Chu Yee
    The numerical results of this work provide an optimum design for a three-dimensional natural convection heat sink on the bus duct conductor's casing. The size of the fin pitch is regarded as a design variable. Using ANSYS FLUENT, a numerical model that closely resembles the experimental setup was created. The experimental data were compared to the IEC 60439-1 and IEC 60439-2 standards as a benchmark. Five potential fin pitch sizes (s1 = 1.0 mm, s2 = 1.5 mm, s3 = 2.0 mm, s4 = 3.0 mm, and s5 = 4.0 mm) were taken into consideration. It was shown that as the fin pitch gap size is reduced, the average surface temperature falls. According to the investigation, conduction resistance increased while convective resistance reduced as the fin pitch gap size grew. The overall heat resistance did, however, rise. The optimal fin pitch size, s1 = 1 mm, outperformed the other fin pitches in terms of thermal performance. The current numerical analysis expects an improved knowledge of the influence of fin pitch on a bus duct conductor's thermal performance.
  • Publication
    Thermal performance optimization for a tapered heat sink of bus bar conductor using definitive screening design
    (Elsevier, 2025-02)
    Mark Selvan
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Khor Chu Yee
    ;
    H.P. Ong
    ;
    Mohd Remy Rozaini Mohd Arif Zainol
    ;
    Nur Izzati Muhammad Nadzri
    This study examines and optimizes four design parameters of a bus duct conductor's heat sink: fin pitch, fin height, fin thickness, and the number of fin valleys. Average surface temperature and Nusselt number are chosen as the thermal performance criterion of the heat sink. A Definitive Screening Design is employed as a statistical method to reduce the number of optimization runs required while minimizing the aliasing. The regression analysis, analysis of variance, main effect analysis and optimization are conducted to optimize the heat sink design parameter and its thermal performance. The current results provide an ideal heat sink design for the casing of bus duct conductors. A fin pitch of 4 mm, fin height of 6.5 mm, fin thickness of 1 mm, and six fin valleys are determined to be the most optimal combination of design parameters. The optimized responses' average surface temperature and Nusselt numbers are 72.05 °C and 21.59, respectively, with 2.97 % and 6.25 % deviation from the predicted values of the empirical equation. The experimental results are benchmarked against the IEC 60439-1 and IEC 60439-2 standards. The current analysis is expected to provide more insight into the impact of design factors on the thermal performance of a bus duct conductor.
  • Publication
    Effects of diameter on copper pillar with solder cap interconnections during reflow soldering process
    (Springer, 2023)
    Jing Rou Lee
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohammad Hafifi Hafiz Ishak
    ;
    Khor Chu Yee
    Recently, the copper pillar with solder cap interconnection has been introduced as an alternative for the solder bump interconnection to tackle the limitations, such as the collapsing nature of the solder bump and larger pitch size. This paper presents an effective simulation tool to evaluate the effects of different diameters of the copper pillar with solder cap during the reflow soldering process. A three-dimensional numerical approach is used to investigate the thermal behavior of the copper pillar with solder caps with different diameters. The interconnection bump diameters are 150, 200, 250, 300, and 350 μm. The model is developed and meshed using the Computational Fluid Dynamics (CFD) software. The temperature distributions of the copper pillar with solder caps with different diameters during the reflow soldering process are predicted. The paper aims to provide an understanding of the effect of diameters on the temperature distribution of copper pillars with solder caps during reflow soldering.