Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
Main Affiliation
Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

Research Output
Now showing 1 - 2 of 2
  • Publication
    Effect of LST parameter on surface morphology of modified copper substrates
    (Malaysian Tribology Society, 2020-09-02)
    Roduan, Siti Faqihah
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Mahayuddin, Nurul Aida Husna
    ;
    Halil, Aiman Mohd
    ;
    Ishak, Mahadzir
    This study aimed to investigate the effect of laser surface texturing (LST) parameter on the surface morphology of copper substrate. The results of different loop number (L1 to L5) on the resolidified material of micro-dimpled surface modified copper substrate were examined. The micro-dimple with a diameter of 100 µm was produced via LST process by varying the dimple distance at 100 µm and 180 µm. The resolidified material that was formed after the surface texturing process was analysed using 3D measuring laser microscope. Based on the data collected, the dimple was successfully engraved on the copper substrate. The increasing number of loop increase the quantity of the melted material which lead to higher amount of resolidified material and surface roughness.
  • Publication
    Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
    ( 2022)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Aiman Bin Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Ishak Muhammad
    ;
    Andrei Victor Sandu
    ;
    Mădălina Simona Baltatu
    ;
    Petrica Vizureanu
    This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
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