Flora Somidin
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Preferred name
Flora Somidin
Official Name
Flora, Somidin
Alternative Name
Somidin, F.
Somidin, Flora
Main Affiliation
Scopus Author ID
54973802500
Researcher ID
GPF-4634-2022

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Publication

Mixed Assembly of Lead-free Solder Joint: A Short Review

2022-01-24 , Rita Mohd Said , Mohd Arif Anuar Mohd Salleh , Ramli M.I.I. , Saud N. , Flora Somidin , Razak N.R.A. , Ismail A.N.

The transition from lead (Pb) to Pb-free solder has arisen the need for the development of the reliability of mixed assemblies solder joint research. Mixed assemblies are defined as solder joints that joint together with different compositions or solder forms for example Ball Grid Array (BGA) and solder paste. During the transition period of solder materials, mixed assemblies are still used in electronic packaging. In addition, Pb-free manufacturing has been forced to release some of the product categories since legislation banning the use of lead solder in electronic assemblies. This phenomenon causes health and environmental concern of the Pb solder used in electronic assembly. Hence, some electronic assemblies will continue to use traditional eutectic Sn-Pb solder paste while others will use Pb-free solder paste. This situation indicates that the use of mixed assemblies in electronics manufacturing is still inevitable. This paper presents a projection of the reliability of mixed assembly's Pb-free solder joint.

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Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints

2022-01-24 , Flora Somidin , Ilias N.F.N. , Zaimi N.S.M. , Ramli M.I.I. , Razak N.R.A.

This paper reports the effect of 1.0 wt.% fly ash (FA) geopolymer ceramic powder addition in Sn-3.0Ag-0.5Cu (SAC305, in wt.%) solder joint. Powder metallurgy route was used to fabricate the new composite solder. Solder balls were formed from the new composite solder and reflowed on Cu substrate. The effect of FA as ceramic reinforcement on the bulk microstructure and the interfacial intermetallic compound layer formation of solder joints were investigated under optical microscope. Microstructure observation showed that the β-Sn dendrite size was refined in SAC305-1.0FA/Cu bulk solder joint sample than that in the non-reinforced sample. The addition of FA geopolymer ceramic powder into the solder matrix also produced a thinner intermetallic compound layer.

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Publication

Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging

2022-01-24 , Flora Somidin , Bakar M.F.A. , Razak N.R.A.

A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.

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Microstructure study of mix assembly lead-free sn-ag-cu ball grid array and Sn-10Cu solder paste

2022-01-24 , Rita Mohd Said , Sulwarajan K.A.P. , Razak N.R.A. , Flora Somidin , Zaimi N.S.M.

In recent years, electronic technologies have been striving to minimize the use of lead in their manufacturing and production. As a result, the electronic packaging industry is slowly transitioning from lead solder to lead-free solder. Though environmentally lead-free solders are advantageous, there are still needs some work in meeting current technological demand and requirements. In this study, the microstructure analysis on lead-free Sn-Ag-Cu Ball Grid Array (BGA) and Sn10Cu solder paste was done. The main aim of this study is to investigate the effect of isothermal aging on the microstructure of the solder paste joint and evaluate the intermetallic compound (IMC) thickness on the solder joint reliability. Optical Microscope (OM) and ImageJ software have been utilized to study the bulk solder microstructure. The results show that the bulk microstructure consists of β-Sn and Cu6Sn5/β-Sn eutectic phases. The IMC layer has undergone rapid growth with increasing aging temperature and time. The two main IMC layers (Cu3Sn and Cu6Sn5) grew thicker due to high temperature. The growth kinetic of Sn10Cu resulted in 16.70 kJ/mol activation level. Therefore, the significance of the findings from this study might provide a potential answer for future development for highly reliable solder joint applications.

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