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Flora Somidin
Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging
2022-01-24
,
Flora Somidin
,
Bakar M.F.A.
,
Razak N.R.A.
A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.