Rita Mohd Said
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Preferred name
Rita Mohd Said
Official Name
Rita, Mohd Said
Alternative Name
Mohd Said, Rita
Said, Rita Mohd
Said, R. M.
Mohd Said, R.
Said, R. Mohd
Main Affiliation
Scopus Author ID
56353112100

Research Output
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  • Publication
    The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings
    (Springer, 2019)
    Mohd Izrul Izwan Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    P. Narayanan
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    J. Chaiprapa
    ;
    Rita Mohd Said
    ;
    S. Yoriya
    ;
    K. Nogita
    The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7Cu solder alloy results in an improvement in the wettability based on dipping tests. The solderability investigation using a globule mode shows the influence of Ni and Bi on the interfacial intermetallic compound (IMC). The addition of Ni to a Sn-0.7Cu solder coating resulted in a (Cu,Ni)6Sn5 interfacial IMC, which enhanced the solderability performance during the globule test. With an increasing amount of Bi in the Sn-0.7Cu-0.05Ni-xBi solder ball, the surface energy of the solder alloy can be reduced, and this improves the solderability. The synchrotron micro-XRF results indicate that Ni is found in a relatively high concentration in the interfacial layer. Additionally, Bi was found to be homogenously distributed in the bulk solder, which improved solderability.