Norainiza Saud
Thumbnail Image
Preferred name
Norainiza Saud
Official Name
Norainiza, Saud
Alternative Name
Saud, N.
Saud, Norainiza
Norainiza, S.
Main Affiliation
Scopus Author ID
56352953900
Researcher ID
AAE-7855-2019

Research Output

Filters
Reset filters

Settings
Now showing 1 - 2 of 2
  • Publication
    Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
    (Springer, 2020)
    Rita Mohd Said
    ;
    Mohammad Zikry Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    H. Yasuda
    ;
    Norainiza Saud
    ;
    K. Nogita
    The feasibility of the highly reliable and replicable microstructure formation of the transient liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the Cu substrate had been successfully investigated in this study. By using the Sn–0.7 wt% Cu (SC) solder paste as the base material and the Cu particles in the production of the TLPS Sn–10 wt% Cu (SC10) solder paste, the ensuing Cu6Sn5 phase from the isothermal aging process was found to have reduced the β-Sn area of the bulk SC10 solder microstructure. The growth kinetic for TLPS SC10 resulted in a 26.76 kJ/mol of activation energy level. The real-time synchrotron radiation imaging technique that was employed in studying the growth and formation of the primary intermetallic phases at the solder joints had also discovered the primary intermetallic in TLPS SC10 was not only found to have experienced an early nucleation just after the solder had melted, but its growth was also restricted prior to the solidification of the liquid solder. Therefore, the relevance of the results that were obtained from this research may offer a possible solution for aiding the future development of highly reliable solder joints in high temperature solder applications.
  • Publication
    Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy
    (Springer, 2024-07-16)
    Tan Chye Lih
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Norainiza Saud
    ;
    T. Nishimura
    ;
    K. Nogita
    The present study explores the effects of minor vanadium (V) addition on Sn-3wt%Ag-5wt%Cu (SAC35) based solder alloy. Weight percentages of V ranging from 0 to 0.15 wt% were investigated. The objective was to study the influence of V on the microstructure, thermal, and mechanical properties of the SAC35 solder alloy. A notable change was observed with the addition of V. The addition of V led to the refinement and enhanced uniformity of the grain size of the intermetallic compounds (IMCs). Furthermore, the IMC thickness at the interface between the solder and Cu substrate was reduced with increasing amounts of V. During solidification, the cooling curve revealed a noteworthy increase in the recalescence value from 10.9 to 13.9 °C after the addition of 0.15wt% V. This indicates that the addition of V might influence the solidification behaviour of the SAC35 solder alloy. Moreover, the undercooling values demonstrated a decreasing trend with the amounts of V increases. This implies that the nucleation process of the SAC35 was facilitated by V addition, resulting in a finer microstructure. The ball shear test demonstrated that the SAC35-xV/Cu solder joints positively impacted the shear strength and ductility by V addition. Overall results showed that the properties of V-alloyed SAC35 solder alloy were improved.