Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction
Journal
Journal of Electronic Materials
ISSN
0361-5235
1543-186X
Date Issued
2023
Author(s)
Jing Rou Lee
Mohd Sharizal Abdul Aziz
Mohammad Hafifi Hafiz Ishak
Roslan Kamarudin
F. Che Ani
DOI
10.1007/s11664-023-10855-3
File(s)