The issue of substituting high lead (Pb) solders in elevated temperature applications such as in high power module devices has been a major concern due to the potential toxicity of lead (Pb) to the environment and human health. A significant increase in health and environmental awareness has paved the way for the development of lead-free solder in the elevated temperature applications. The alloying element plays an important role in Pb-free solder as it relates to the reliability of bonding, as well as the mechanical, thermal and electrical properties of solder joint. The addition of nickel (Ni) tends to enhance the microstructure of the solder and the formation of intermetallic compounds, as well as the properties of the solder joints, yet the experimental data on the effect of the addition of nickel on the high temperature applications is not established and still open for discussion. In this paper, a review on recent research on the effect of nickel addition on the high temperature applications such as in high power module devices is studied.
