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  5. Wafer process failure improvement by applying TRIZ and AHP methods
 
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Wafer process failure improvement by applying TRIZ and AHP methods

Date Issued
2020
Author(s)
Syed Abdullah Syed Alwi
Handle (URI)
https://hdl.handle.net/20.500.14170/11284
Abstract
In manufacturing industries, problems or issues in production lines are common. To resolve those setbacks in the most effective ways is necessary. However, increasing cost and time taken to solve it are important criteria for consideration. Longer downtime in any production line is bad news as product must be delivered on a specific time as per agreement with the customer. Managing to solve a major problem successfully is essential for production line to run smoothly and delivered its commitment on time. Thus, a systematic approach to problem-solving ought to be planned. In this paper, a combination of TRIZ and AHP method are used as a problem-solving strategy to achieve an appropriate solution.
Subjects
  • TRIZ method

  • Downtime

  • Production line

  • AHP method

File(s)
Pages 1-24.pdf (526.17 KB) Full text.pdf (1.21 MB) Declaration Form.pdf (323.31 KB)
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