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Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

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cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department dddac5f4-97ee-45b9-a38a-4bf759a9c138
dc.contributor.author Chong Hooi Lim
dc.contributor.author M.Z. Abdullah
dc.contributor.author I. Abdul Azid
dc.contributor.author Khor Chu Yee
dc.contributor.author M.S. Abdul Aziz
dc.contributor.author M.H.H. Ishaik
dc.date.accessioned 2025-12-04T07:15:38Z
dc.date.available 2025-12-04T07:15:38Z
dc.date.issued 2020
dc.description.abstract Purpose: The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach: The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings: It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and (Formula presented.) were found to be significantly affected by most of the parametric factors. Practical implications: This study provides a better understanding of the process control in FPCB assembly. Originality/value: This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.
dc.identifier.doi 10.1108/CW-02-2020-0016
dc.identifier.uri https://www.emerald.com/cw/article-abstract/47/2/213/45021/Heat-transfer-and-deformation-analysis-of-flexible?redirectedFrom=fulltext
dc.identifier.uri https://www.sciencedirect.com/org/science/article/abs/pii/S0305612020000580
dc.identifier.uri https://hdl.handle.net/20.500.14170/15422
dc.language.iso en
dc.publisher Emerald Publishing
dc.relation.ispartof Circuit World
dc.relation.issn 0305-6120
dc.relation.issn 0305-6120
dc.subject BGA
dc.subject CFD
dc.subject Electronic cooling
dc.subject Empirical correlation equations
dc.subject Flexible printed circuit board
dc.title Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects
dc.type journal-article
dspace.entity.type Publication
oaire.citation.endPage 221
oaire.citation.issue 2
oaire.citation.startPage 213
oaire.citation.volume 47
oairecerif.author.affiliation Universiti Tunku Abdul Rahman
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Kuala Lumpur
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Sains Malaysia
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