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Effect of wetting characteristics of dimpled micro-textured substrate on the spreading area of Sn–0.7Cu solder alloy

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cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department 3b7a6d2b-ac99-485f-bae7-4830f2684300
cris.virtualsource.department b818f9b7-a3ab-438f-bd2c-40cf513d8798
dc.contributor.author Siti Faqihah Roduan
dc.contributor.author Juyana A. Wahab
dc.contributor.author Mohd Arif Anuar Mohd Salleh
dc.contributor.author Nurul Aida Husna Mohd Mahayuddin
dc.contributor.author Aiman Mohd Halil
dc.contributor.author Amira Qistina Syamimi Zaifuddin
dc.contributor.author Mahadzir Muhammad Ishak
dc.date.accessioned 2026-01-05T03:36:22Z
dc.date.available 2026-01-05T03:36:22Z
dc.date.issued 2023
dc.description.abstract This study aimed to investigate the effect of wetting characteristics of a dimpled micro-textured copper substrate on the spreading area of the Sn–0.7Cu solder alloy. A laser surface texturing (LST) technique was used to fabricate dimpled micro-textured on the copper substrate. Three samples were fabricated by varying the dimple spacing on the copper substrate such as 100, 140, and 180 µm. A 3D measuring laser microscope was used to study the surface roughness. The copper substrates’ water contact angle measurement and surface roughness were studied for their wetting characteristics. In order to study the effect of wetting characteristics of the dimpled micro-textured copper substrate, spreading area measurement was conducted. The result showed that dimpled micro-textured introduces higher surface roughness and contact angle, increasing the hydrophobicity. Consequently, this reduces the spreading area of Sn–0.7Cu solder alloy.
dc.identifier.doi 10.1007/978-981-19-9267-4_83
dc.identifier.isbn 9789811992667
dc.identifier.isbn 9789811992674
dc.identifier.uri https://link.springer.com/chapter/10.1007/978-981-19-9267-4_83
dc.identifier.uri https://link-springer-com.
dc.identifier.uri https://hdl.handle.net/20.500.14170/15615
dc.language.iso en
dc.publisher Springer
dc.relation.conference Green Materials and Electronic Packaging Interconnect Technology Symposium (EPITS 2022), 14-15 September 2022, Langkawi, Malaysia.
dc.relation.ispartof Springer Proceedings in Physics
dc.relation.ispartof Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
dc.relation.issn 0930-8989
dc.relation.issn 1867-4941
dc.subject Hydrophobicity
dc.subject Sn–0.7Cu solder
dc.subject Surface roughness
dc.subject Surface texturing
dc.subject Water contact angle
dc.subject Wettability
dc.title Effect of wetting characteristics of dimpled micro-textured substrate on the spreading area of Sn–0.7Cu solder alloy
dc.type Resource Types::text::conference output::conference proceedings::conference paper
dspace.entity.type Publication
oaire.citation.endPage 850
oaire.citation.startPage 843
oaire.citation.volume 289
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Pahang Al-Sultan Abdullah
oairecerif.author.affiliation Universiti Malaysia Pahang Al-Sultan Abdullah
oairecerif.author.affiliation Universiti Malaysia Pahang Al-Sultan Abdullah
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