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  1. Home
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  5. Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution
 
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Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution

Journal
IOP Conference Series: Materials Science and Engineering
ISSN
17578981
Date Issued
2018-03-19
Author(s)
Nordarina J.
Mohd H.Z.
Ahmad A.M.
Muhammad F.M.N.
DOI
10.1088/1757-899X/318/1/012003
Handle (URI)
https://hdl.handle.net/20.500.14170/12427
Abstract
The corrosion properties of Sn-9(5Al-Zn), Sn-Cu and SAC305 were studied via potentiodynamic polarization method in an acidic solution of 1 M hydrochloric acid (HCl). Sn-9(5Al-Zn) produced different polarization profile compared with Sn-Cu and SAC305. The morphological analysis showed that small, deep grooves shaped of corrosion product formed on top of Sn-9(5Al-Zn) solder while two distinctive structures of closely packed and loosely packed corrosion product formed on top of Sn-Cu and SAC305 solder alloys. Phase analysis revealed the formations of various corrosion products such as SnO and SnO2 mainly dominant on surface of solder alloys after potentiodynamic polarization in 1 M hydrochloric acid (HCl).
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