Corrosion properties of Sn-9Zn and Sn-0.7Cu solder were investigated in 3.5 wt.% NaCl. The scanning rates used were fixed at 1.0mVs-1 to study the effect of different adding element which is Cu and Zn into the corrosion properties of Sn-based solder. The morphological and structural properties of the samples were compared before and after the corrosion. The morphological analysis observed two types of corrosion product which is compacted and loosely-compacted corrosion product after the samples was polarized in 3.5% NaCl solution.
