The physical dimension of solder joint plays an important role in the joint reliability during the surface mount technology (SMT) assembly process. During the SMT process, the thermal induced stress, strain and displacement is difficult to visualize and assess. The objective of the study is to tackle these problems via simulation analysis technique using the Finite element based software. A model of electronic package was considered and created in the simulation software. The effect of the solder joint height to stress, strain and displacement were investigated. The results revealed that the solder height crucially influence the maximum stress to the solder joint. Besides, solder height also affects the displacement and strain of the solder joint during the analysis. The increment of the solder height yielded the increment of the strain and displacement of the solder joint. The lowest maximum stress was found on the 0.45mm of solder joint. Thus, the results are expected to enhance the understanding the thermos-mechanical characteristics of solder joint in the electronic packaging research field.
