Case study on thermal cycling analysis for different solder joint sizes using Finite Element Analysis

This research uses finite element analysis to investigate the impact of different solder joint sizes on the mechanical aspects. Specifically, a three-dimensional model of a leadless solder joint for surface mount components was created in simulation software. The study analyses lead-free solder joint thermo-mechanical properties, such as maximum stress and strain. The simulation results indicate that the solder joints parameters significantly influence the thermo-mechanical behaviour during temperature cycling tests. The highest stress is observed at the interface between the solder and pad on the large-size solder joint, while the lowest stress (118MPa) is recorded when employing a small-size solder joint. This research contributes to a better understanding the thermo-mechanical characteristics of different solder joint parameters under temperature cycling conditions.