This research focuses on optimising mechanical shock testing for advanced ball grid array (BGA) packages using finite element analysis. This research aims to analyse the parameters in mechanical shock testing for advanced BGA packages and optimise their mechanical strength using Response Surface Methodology (RSM). This research employs two methods: Finite Element Analysis and RSM. The methodology involves investigating three parameters: impact frequency, stand-off height, and solder ball diameter through numerical experimentation. Three responses, namely stress, strain, and displacement, are obtained to achieve an optimal result using RSM. The numerical experiments are conducted using finite element software, specifically on advanced BGA packages. The findings of this study contribute to result optimisation and provide an understanding of the most significant parameters and responses. High displacement affects neighbouring circuit board parts and solder joints, leading to broken links and connections. Besides, high acceleration could lead to loose bolts, relay chattering, and slipping of the variable resistor in integrated circuit (IC) packages. The validation process is performed to verify the results obtained from the numerical experiments
