Thermal management is essential in electronic components and devices. Overheating of the
component leads to malfunction. This study investigates the effects of velocity and heat flux
on the Plastic Leaded Chip Carrier (PLCC) during the thermal cooling process via
simulation analysis. Computational fluid dynamics software simulated the cooling process
of PLCC. The size of the PLCC used is 2.72 cm × 2.72 cm × 0.38 cm. The effect of heat flux
and velocity on temperature distribution, flow pattern, and pressure distribution was
studied. The findings indicated that as the approach air velocity increased, the
temperature of the packages decreased. The result also shows that the static pressure
decrease along with the package when the air velocity increases. The simulation results are
expected to understand better the cooling process of PLCC in the thermal management of
electronic components and devices.
