Publication:
Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief
Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief
| cris.virtual.department | Universiti Malaysia Perlis | |
| cris.virtualsource.department | 22938211-1c5b-44cd-9e58-7a41bc2cc83b | |
| dc.contributor.author | Fatin Sufina Mohd Tarmizi | |
| dc.contributor.author | Mohamad Najmi Masri | |
| dc.contributor.author | Muhammad Firdaus Mohd Nazeri | |
| dc.contributor.author | Ahmad Azmin Mohamad | |
| dc.date.accessioned | 2025-07-27T07:46:58Z | |
| dc.date.available | 2025-07-27T07:46:58Z | |
| dc.date.issued | 2020 | |
| dc.description.abstract | Sn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential. | |
| dc.identifier.doi | 10.1088/1755-1315/596/1/012038 | |
| dc.identifier.uri | https://iopscience.iop.org/article/10.1088/1755-1315/596/1/012038/pdf | |
| dc.identifier.uri | https://iopscience.iop.org/article/10.1088/1755-1315/596/1/012038 | |
| dc.identifier.uri | https://iopscience.iop.org/ | |
| dc.identifier.uri | https://hdl.handle.net/20.500.14170/14265 | |
| dc.language.iso | en | |
| dc.publisher | IOP Publishing | |
| dc.relation.conference | International Conference on Science and Technology 2020 | |
| dc.relation.ispartof | IOP Conference Series: Earth and Environmental Science | |
| dc.relation.issn | 1755-1307 | |
| dc.relation.issn | 1755-1315 | |
| dc.subject | Solder | |
| dc.title | Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief | |
| dc.type | Resource Types::text::conference output::conference proceedings | |
| dspace.entity.type | Publication | |
| oaire.citation.endPage | 6 | |
| oaire.citation.issue | 1 | |
| oaire.citation.startPage | 1 | |
| oaire.citation.volume | 596 | |
| oairecerif.author.affiliation | Universiti Malaysia Kelantan | |
| oairecerif.author.affiliation | Universiti Malaysia Kelantan | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Universiti Sains Malaysia |
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