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Muhammad Firdaus Mohd Nazeri
Microstructural analysis of Sn-3.0Ag-0.5Cu-TiOâ‚‚ composite solder alloy after selective electrochemical etching
2020-01
,
Muhamad Zamri Yahaya
,
Muhammad Firdaus Mohd Nazeri
,
Soorathep Kheawhom
,
Balázs Illés
,
Agata Skwarek
,
Ahmad Azmin Mohamad
This work aims to provide deep morphological observation on the incorporated TiO₂ nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of-350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO₂ near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO₂ nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO₂ nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO₂ content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO₂ reinforcement particles.