Muhammad Firdaus Mohd Nazeri
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Preferred name
Muhammad Firdaus Mohd Nazeri
Official Name
Muhammad Firdaus , Mohd Nazeri
Alternative Name
Nazeri, Muhammad Firdaus Mohd
Nazeri, M. F.M.
Nazeri, M. F.Mohd
Nazeri, Muhammad Firdaus
Main Affiliation
Scopus Author ID
55206645000
Researcher ID
C-8522-2019

Research Output
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Microstructural analysis of Sn-3.0Ag-0.5Cu-TiOâ‚‚ composite solder alloy after selective electrochemical etching

2020-01 , Muhamad Zamri Yahaya , Muhammad Firdaus Mohd Nazeri , Soorathep Kheawhom , Balázs Illés , Agata Skwarek , Ahmad Azmin Mohamad

This work aims to provide deep morphological observation on the incorporated TiO₂ nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of-350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO₂ near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO₂ nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO₂ nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO₂ content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO₂ reinforcement particles.

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Selective etching and hardness properties of quenched SAC305 solder joints

2020 , Muhamad Zamri Yahaya , Nor Azmira Salleh , Soorathep Kheawhom , Balazs Illes , Muhammad Firdaus Mohd Nazeri , Ahmad Azmin Mohamad

Purpose: The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions. Design/methodology/approach: SAC305 solder joints were prepared under different cooling conditions/rates. The performance of three different etching methods was investigated: simple chemical etching, deep etching based on the Jackson method and selective removal of β-Sn by a standard three-electrode cell method. Phase and structural analyses were conducted by X-ray diffraction (XRD). The morphology of etched solder was examined by a field emission scanning electron microscope. The hardness evaluations of the solder joints were conducted by a Vickers microhardness tester. Findings: The Ag3Sn network was significantly refined by the ice-quenching process. Further, the thickness of the Cu6Sn5 layer decreased with an increase in the cooling rate. The finer Ag3Sn network and the thinner Cu6Sn5 IMC layer were the results of the reduced solidification time. The ice-quenched solder joints showed the highest hardness values because of the refinement of the Ag3Sn and Cu6Sn5 phases. Originality/value: The reduction in the XRD peak intensities showed the influence of the cooling condition on the formation of the different phases. The micrographs prepared by electrochemical etching revealed better observations regarding the shape and texture of the IMC phases than those prepared by the conventional etching method. The lower grain orientation sensitivity of the electrochemical etching method (unlike chemical etching) significantly improved the micrographs and enabled accurate observation of IMC phases.

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