Muhammad Firdaus Mohd Nazeri
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Preferred name
Muhammad Firdaus Mohd Nazeri
Official Name
Muhammad Firdaus , Mohd Nazeri
Alternative Name
Nazeri, Muhammad Firdaus Mohd
Nazeri, M. F.M.
Nazeri, M. F.Mohd
Nazeri, Muhammad Firdaus
Main Affiliation
Scopus Author ID
55206645000
Researcher ID
C-8522-2019

Research Output
Now showing 1 - 5 of 5
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The effect of Al micro-alloying on corrosion and thermal properties of Sn-Zn alloy

2020 , Nordarina Jumali , Nurwahida Mohd Zaini , Nur Syamira Sa'don , Ahmad Azmin Mohamad , Muhammad Firdaus Mohd Nazeri

Electrochemical corrosion behavior of Sn–Zn solder alloys in 6 M potassium hydroxide solution was investigated by potentiodynamic polarization technique, aiming to investigate the role of Al additions. The effect of micro-alloying Al on the thermal properties was also studied by using DSC. The results reveal that the presence of Al content leads to increasing in corrosion potential yet reducing the corrosion current density and passivation current density, simultaneously. XRD analysis reveals the failure to produce new compound with Zn, limits the effect of adding Al towards the corrosion performance. Yet, significant improvement on thermal properties were seen, especially on the melting temperature and pasty range without modifying the eutectic melting behavior.

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Selective etching and hardness properties of quenched SAC305 solder joints

2020 , Muhamad Zamri Yahaya , Nor Azmira Salleh , Soorathep Kheawhom , Balazs Illes , Muhammad Firdaus Mohd Nazeri , Ahmad Azmin Mohamad

Purpose: The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions. Design/methodology/approach: SAC305 solder joints were prepared under different cooling conditions/rates. The performance of three different etching methods was investigated: simple chemical etching, deep etching based on the Jackson method and selective removal of β-Sn by a standard three-electrode cell method. Phase and structural analyses were conducted by X-ray diffraction (XRD). The morphology of etched solder was examined by a field emission scanning electron microscope. The hardness evaluations of the solder joints were conducted by a Vickers microhardness tester. Findings: The Ag3Sn network was significantly refined by the ice-quenching process. Further, the thickness of the Cu6Sn5 layer decreased with an increase in the cooling rate. The finer Ag3Sn network and the thinner Cu6Sn5 IMC layer were the results of the reduced solidification time. The ice-quenched solder joints showed the highest hardness values because of the refinement of the Ag3Sn and Cu6Sn5 phases. Originality/value: The reduction in the XRD peak intensities showed the influence of the cooling condition on the formation of the different phases. The micrographs prepared by electrochemical etching revealed better observations regarding the shape and texture of the IMC phases than those prepared by the conventional etching method. The lower grain orientation sensitivity of the electrochemical etching method (unlike chemical etching) significantly improved the micrographs and enabled accurate observation of IMC phases.

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Microstructural analysis of Sn-3.0Ag-0.5Cu-TiOâ‚‚ composite solder alloy after selective electrochemical etching

2020-01 , Muhamad Zamri Yahaya , Muhammad Firdaus Mohd Nazeri , Soorathep Kheawhom , Balázs Illés , Agata Skwarek , Ahmad Azmin Mohamad

This work aims to provide deep morphological observation on the incorporated TiO₂ nanoparticles within the SAC305 by selective electrochemical etching. Cyclic voltammetry and chronoamperometry were used to investigate the selective etching performances. The removal of β-Sn matrix was conducted at a fixed potential of-350 mV. Average performances of 2.19 and 2.30 mA were attained from the chronoamperometry. The efficiency of β-Sn removal was approved according to the reduction of the intensities on the phase analysis. Successful observation of the TiO₂ near the Cu6Sn5 layer was attained for an optimum duration of 120 s. Clusters of TiO₂ nanoparticles were entrapped by Cu6Sn5 and Ag3Sn intermetallic compound (IMC) layer network and at the solder/substrate interface. The presence of TiO₂ nanoparticles at the solder interface suppresses the growth of the Cu6Sn5 IMC layer. The absence of a β-Sn matrix also allowed in-depth morphological observations to be made of the shape and size of the Cu6Sn5 and Ag3Sn. It was found that TiO₂ content facilitates the β-Sn removal, which allows better observation of the IMC phases as well as the TiO₂ reinforcement particles.

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Corrosion Investigation of Sn-0.7Cu Pb-Free solder in open-circuit and polarized conditions

2020 , Mohd Zohirul Haziq Aziz , Nasihah Zainon , Ahmad Azmin Mohamad , Muhammad Firdaus Mohd Nazeri

The corrosion performance of Sn-0.7Cu solder alloy was investigated in 1 M hydrochloride acid by means of open-circuit potential and potentiodynamic polarization techniques. In open-circuit potential measurement, the potential showed almost constant reading after achieving potential -550 mV, consistent with single dissolution peak observed in potentiodynamic polarization. This revealed single element dissolution process of Sn took place. Supporting morphological and phase analyses were done by using scanning electron microscope and X-ray diffraction. Phase analysis confirmed the corrosion product are SnO and SnO2. Morphological analysis showed two type of oxide layer formed as corrosion product, which are compact oxide layer and loose rod-like oxide layer after polarization, while rod-like corrosion product was diminished in open-circuit condition. This indicate that complete protection from further corrosion was impossible due to the incomplete passivation layer formation in potentiodynamic polarization.

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Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief

2020 , Fatin Sufina Mohd Tarmizi , Mohamad Najmi Masri , Muhammad Firdaus Mohd Nazeri , Ahmad Azmin Mohamad

Sn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential.

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