Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 5 of 5
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Study on the addition of nanoparticles in the lead-free solder during reflow soldering via numerical simulation - a review

2020-12 , Intan Norshalina Sahrudin , Mohd Sharizal Abdul Aziz , Mohd. Zulkifly Abdullah , Mohd Arif Anuar Mohd Salleh

Surface mount technology (SMT) is a method of electronic components mounting or placed directly on the surface of the circuit board. The solder will be printed onto the substrate on the printed circuit board (PCB) and then undergoes reflow soldering process. As the used of lead (Pb) is restricted by the restriction of hazardous substances (RoHS) directive in 2006 and Waste Electrical and Electronic Equipment (WEE), the study on the addition of nanoparticles into the lead-free solder has increased as to increase the reliability and quality of the lead-free solder. Researchers have added Cobalt, Silver, Molybdenum, Diamond, Silicon, Zinc, Zinc oxide and many more to increase few solder criteria such as the wetting properties, mechanical properties and the intermetallic compound (IMC) layers. Many numerical simulation methods such as finite element (FEM), finite volume (FVM), Lattice Boltzmann method (LBM), discrete phase method (DPM), and molecular dynamic (MD) simulation have been used to clearly show the reflow soldering process and to cut the cost of experimental work.

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Publication

Effect of Ni on the suppression of sn whisker formation in Sn-0.7Cu solder joint

2021 , Aimi Noorliyana Hashim , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Muhammad Mahyiddin Ramli , Khor Chu Yee , Noor Zaimah Mohd Mokhtar , Jitrin Chaiprapa

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.

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Effect of surface-modified copper substrate by photolithography on the solderability of lead-free solder alloy

2023-07 , Nurul Aida Husna Mohd Mahayuddin , Juyana A. Wahab , Siti Faqihah Roduan , Mohd Arif Anuar Mohd Salleh

Various modifications of copper substrates have been developed for soldering applications due to their promising properties. The present study aimed to investigate the effect of dimple micro-texture on a copper substrate surface on soldering. Photolithography technique was used to fabricate a dimple micro-texture onto copper substrate. After surface texturing, the copper substrate was reflowed with Sn–0.7Cu solder. The surface microstructural was determined using optical microscopy (OM), the 3D surface profiler, and visual tests. The spreading area of the Sn–0.7Cu solder and the copper substrate was also examined. In comparison with Sn-0.7Cu solder on textured surface, TD500 has larger spreading area as the diameter was large nearly equivalent to non-textured surface. However, Sn–0.7Cu textured substrate exhibits low spreading area than non-textured surface that is beneficial for solderability properties.

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Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

2022 , Siti Faqihah Roduan , Juyana A. Wahab , Mohd Arif Anuar Mohd Salleh , Nurul Aida Husna Mohd Mahayuddin , Mohd. Mustafa Al Bakri Abdullah , Aiman Bin Mohd Halil , Amira Qistina Syamimi Zaifuddin , Mahadzir Ishak Muhammad , Andrei Victor Sandu , Mădălina Simona Baltatu , Petrica Vizureanu

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.

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Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint

2021 , Aimi Noorliyana Hashim , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Muhammad Mahyiddin Ramli , Khor Chu Yee , Noor Zaimah Mohd Mokhtar , Jitrin Chaiprapa

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.

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