Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 5 of 5
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Contribution of interfacial bonding towards geopolymers properties in geopolymers reinforced fibers: a review

2022 , Muhd Hafizuddin Yazid , Meor Ahmad Faris bin Meor Ahmad Tajudin , Mohd. Mustafa Al Bakri Abdullah , Marcin Nabiałek , Shayfull Zamree Abd. Rahim , Mohd Arif Anuar Mohd Salleh , Marwan Kheimi , Andrei Victor Sandu , Adam Rylski , Bartłomiej Jeż

There is a burgeoning interest in the development of geopolymers as sustainable construction materials and incombustible inorganic polymers. However, geopolymers show quasi-brittle behavior. To overcome this weakness, hundreds of researchers have focused on the development, characterization, and implementation of geopolymer-reinforced fibers for a wide range of applications for light geopolymers concrete. This paper discusses the rapidly developing geopolymer-reinforced fibers, focusing on material and geometrical properties, numerical simulation, and the effect of fibers on the geopolymers. In the section on the effect of fibers on the geopolymers, a comparison between single and hybrid fibers will show the compressive strength and toughness of each type of fiber. It is proposed that interfacial bonding between matrix and fibers is important to obtain better results, and interfacial bonding between matrix and fiber depends on the type of material surface contact area, such as being hydrophobic or hydrophilic, as well as the softness or roughness of the surface.

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Formation and growth of intermetallic compounds in lead-free solder joints: a review

2022 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Mohd. Mustafa Al Bakri Abdullah , Nur Syahirah Mohamad Zaimi , Andrei Victor Sandu , Petrica Vizureanu , Adam Rylski , Siti Farahnabilah Muhd Amli

Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

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Microstructural studies of Ag/TiO2 thin film; effect of annealing temperature

2021 , Kamrosni Abdul Razak , C.H. Dewi Suryani , A. Azliza , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Norsuria Mahmed , V. Chobpattana , L. Kaczmarek , B. Jeż , M. Nabiałek

Microstructures are an important link between materials processing and performance, and microstructure control is essential for any materials processing route where the microstructure plays a major role in determining the properties. In this work, silverdoped titanium dioxide (Ag/TiO2) thin film was prepared by the sol-gel method through the hydrolysis of titanium tetra-isopropoxide and silver nitrate solution. The sol was spin coated on ITO glass substrate to get uniform film followed by annealing process for 2 hours. The obtained films were annealed at different annealing temperatures in the range of 300°C-600°C in order to observe the effect on crystalline state, microstructures and optical properties of Ag/TiO2 thin film. The thin films were characterized by X-Ray diffraction (XRD), scanning electron microscopy (SEM), and UV-Vis spectrophotometry. It is clearly seen, when the annealing temperature increases to 500°C, a peak at 2θ = 25.30° can be seen which refers to the structure of TiO2 tetragonal anatase. The structure of Ag/TiO2 thin film become denser, linked together, porous and uniformly distributed on the surface and displays the highest cut-off wavelength value which is 396 nm with the lowest band gap value, which is 3.10 eV. Keywords: Ag/TiO2; Annealing Temperature; Microstructure; Optical Properties; Thin Film

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Contribution of interfacial bonding towards geopolymers properties in geopolymers reinforced fibers: A review

2022 , Muhd Hafizuddin Yazid , Meor Ahmad Faris bin Meor Ahmad Tajudin , Mohd. Mustafa Al Bakri Abdullah , Marcin Nabiałek , Shayfull Zamree Abd. Rahim , Mohd Arif Anuar Mohd Salleh , Marwan Kheimi , Andrei Victor Sandu , Adam Rylski , Bartłomiej Jeż

There is a burgeoning interest in the development of geopolymers as sustainable construction materials and incombustible inorganic polymers. However, geopolymers show quasi-brittle behavior. To overcome this weakness, hundreds of researchers have focused on the development, characterization, and implementation of geopolymer-reinforced fibers for a wide range of applications for light geopolymers concrete. This paper discusses the rapidly developing geopolymer-reinforced fibers, focusing on material and geometrical properties, numerical simulation, and the effect of fibers on the geopolymers. In the section on the effect of fibers on the geopolymers, a comparison between single and hybrid fibers will show the compressive strength and toughness of each type of fiber. It is proposed that interfacial bonding between matrix and fibers is important to obtain better results, and interfacial bonding between matrix and fiber depends on the type of material surface contact area, such as being hydrophobic or hydrophilic, as well as the softness or roughness of the surface.

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Influence of 1.5 wt.% Bi on the microstructure, hardness, and shear strength of Sn-0.7Cu solder joints after isothermal annealing

2021 , Mohd Izrul Izwan Ramli , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Siti Farahnabilah Muhd Amli , Rita Mohd Said , Norainiza Saud , Mohd. Mustafa Al Bakri Abdullah , Petrica Vizureanu , Adam Rylski , Jitrin Chaiprapa , Marcin Nabialek

This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth’s activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol−1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.

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