Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 2 of 2
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Publication

The investigation of ground granulated blast furnace slag geopolymer at high temperature by using electron backscatter diffraction analysis

2021 , Ikmal Hakem Aziz , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Sorachon Yoriya , Rafiza Abd Razak , Rosnita Mohamed , Madalina Simona Baltatu

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Publication

Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy

2022 , Siti Faqihah Roduan , Juyana A. Wahab , Mohd Arif Anuar Mohd Salleh , Nurul Aida Husna Mohd Mahayuddin , Mohd. Mustafa Al Bakri Abdullah , Aiman Bin Mohd Halil , Amira Qistina Syamimi Zaifuddin , Mahadzir Ishak Muhammad , Andrei Victor Sandu , Mădălina Simona Baltatu , Petrica Vizureanu

This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.

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