Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

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Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites

2024-03-01 , Khairul Anwar Abdul Halim , Mohd Arif Anuar Mohd Salleh , Badrul F. , Azlin Fazlina Osman , Mohd Firdaus Omar , Suhaimi A.S. , Muhammad Salihin Zakaria

Conductive polymer composites (CPCs) with the ability to maintain high conductivity whilst remaining flexible at various operating temperatures and conditions have gained interest as potential materials for electronic interconnect applications. The ability of a polymer matrix to conduct electricity is mainly dependent on the conductive filler loadings as well as the formation of network paths within the CPCs. The main aim of this research work was to establish and understand the correlation between the network structure formation and mechanical properties of linear low-density polyethylene/copper (LLDPE/Cu) and liquid silicone rubber/copper (LSR/Cu) CPCs. Various techniques such as electron microscopy, thermal studies, four-point probe, and tensile testing were employed in this study. Furthermore, selected samples were characterized and tested using synchrotron micro-x-ray fluorescence (XRF) technique and dynamic mechanical analysis (DMA). It was found that the electrical conductivity of the CPCs increased with increasing filler loadings. Addition of Cu filler had a marginal effect on the tensile strength of both LLDPE/Cu and LSR/Cu CPCs. Nevertheless, it was found that the elongation at break for LLDPE/Cu consistently increased with the addition of Cu whereas, for LSR/Cu samples, the elongation at break decreased with the addition of Cu at various loadings. The scanning electron microscopy (SEM) micrographs obtained show that the particles of Cu were closer to one another at higher filler loadings. The data obtained revealed the potential for utilizing CPCs as flexible interconnects suitable for advanced electronic applications.

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Microstructural studies of ag/tio2 thin film; effect of annealing temperature

2022-01-01 , Kamrosni A.R. , Dewi Suriyani Che Halin , Azliza A. , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Norsuria Mahmed , Chobpattana V. , Kaczmarek L. , Jez B. , Nabialek M.

Microstructures are an important link between materials processing and performance, and microstructure control is essential for any materials processing route where the microstructure plays a major role in determining the properties. In this work, silverdoped titanium dioxide (Ag/TiO2) thin film was prepared by the sol-gel method through the hydrolysis of titanium tetra-isopropoxide and silver nitrate solution. The sol was spin coated on ITO glass substrate to get uniform film followed by annealing process for 2 hours. The obtained films were annealed at different annealing temperatures in the range of 300°C-600°C in order to observe the effect on crystalline state, microstructures and optical properties of Ag/TiO2thin film. The thin films were characterized by X-Ray diffraction (XRD), scanning electron microscopy (SEM), and UV-Vis spectrophotometry. It is clearly seen, when the annealing temperature increases to 500°C, a peak at 2θ = 25.30° can be seen which refers to the structure of TiO2tetragonal anatase. The structure of Ag/TiO2thin film become denser, linked together, porous and uniformly distributed on the surface and displays the highest cut-off wavelength value which is 396 nm with the lowest band gap value, which is 3.10 eV.

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Effect of Various Conductive Filler Additions on the Percolations Threshold of LLDPE Conductive Polymer Composites

2022-07-01 , Badrul F. , Halim K.A.A. , Mohd Arif Anuar Mohd Salleh , Osman A.F. , Omar M.F. , Zakaria M.S. , Jeż B. , Nabiałek M.

Polymeric materials are known to have insulating properties in general. Nevertheless, the insulating nature of polymers can be turned into electrically conductive by adding conductive fillers subjected to their critical filler loading or percolation threshold. In this study, the effects of various conductive fillers additions, namely copper, silver, and carbon black, on the percolation threshold of linear low-density polyethylene conductive polymer composites were investigated. The mechanical properties were determined using the tensile test, and the electrical conductivity was determined using the four-point probe. The incorporation of conductive fillers generally had an impact on the tensile strength and elongation at the break of the linear low-density polyethylene conductive polymer composites. Nonetheless, it was found that the electrical conductivity of all composites increases where the percolation threshold is estimated for carbon black at 2 wt% and for Ag and Cu at 6 wt% of filler additions.

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Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of sn-0.7cu on different surface finish substrates

2020-12-01 , Ramli M.I.I. , Mohd Arif Anuar Mohd Salleh , Amli S.F.M. , Razak N.R.A.

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

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Factors of Controlling the Formation of Titanium Dioxide (TiO2) Synthesized using Sol-gel Method - A Short Review

2022-01-24 , Abdul Razak K. , Dewi Suriyani Che Halin , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Mahmed N. , Azani A. , Chobpattana V.

There have been experiments on TiO2 thin films synthesized utilizing sol-gel techniques. The sol-gel method is a straightforward technology that gives numerous benefits to the researcher, for instance, material's reliability, reproducibility, and controllability. Following from there, it can be utilized to make high-quality nano-structured thin films. According to previous studies, the TiO2 films' characteristics occur to be highly dependent on the production parameters and initial materials utilized. Controlling the formation of TiO2 thin films with the sol-gel method was momentarily discussed here.

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Mixed Assembly of Lead-free Solder Joint: A Short Review

2022-01-24 , Rita Mohd Said , Mohd Arif Anuar Mohd Salleh , Ramli M.I.I. , Saud N. , Flora Somidin , Razak N.R.A. , Ismail A.N.

The transition from lead (Pb) to Pb-free solder has arisen the need for the development of the reliability of mixed assemblies solder joint research. Mixed assemblies are defined as solder joints that joint together with different compositions or solder forms for example Ball Grid Array (BGA) and solder paste. During the transition period of solder materials, mixed assemblies are still used in electronic packaging. In addition, Pb-free manufacturing has been forced to release some of the product categories since legislation banning the use of lead solder in electronic assemblies. This phenomenon causes health and environmental concern of the Pb solder used in electronic assembly. Hence, some electronic assemblies will continue to use traditional eutectic Sn-Pb solder paste while others will use Pb-free solder paste. This situation indicates that the use of mixed assemblies in electronics manufacturing is still inevitable. This paper presents a projection of the reliability of mixed assembly's Pb-free solder joint.

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Characterization of SnOâ‚‚/TiOâ‚‚ With The Addition of Polyethylene Glycol Via Sol-Gel Method For Self-Cleaning Application

2023-01-01 , Halin D.S.C. , Azliza A. , Razak K.A. , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Wahab J.A. , Chobpattana V. , Kaczmarek L. , Nabiałek M. , Jeż B.

TiO2 is one of the most widely used metal oxide semiconductors in the field of photocatalysis for the self-cleaning purpose to withdraw pollutants. Polyethylene glycol (PEG) is recommended as a stabilizer and booster during preparation of water-soluble TiO2. Preparation of SnO2/TiO2 thin film deposition on the surface of ceramic tile was carried out by the sol-gel spin coating method by adding different amount of PEG (0g, 0.2g, 0.4g, 0.6g, 0.8g) during the preparation of the sol precursor. The effects of PEG content and the annealing temperature on the phase composition, crystallite size and the hydrophilic properties of SnO2/TiO2 films were studied. The X-ray diffraction (XRD) spectra revealed different phases existed when the films were annealed at different annealing temperatures of 350°C, 550°C and 750°C with 0.4 g of PEG addition. The crystallite sizes of the films were measured using Scherrer equation. It shows crystallite size was dependent on crystal structure existed in the films. The films with mixed phases of brookite and rutile shows the smallest crystallite size. In order to measure the hydrophilicity properties of films, the water contact angles for each film with different content of PEG were measured. It can be observed that the water contact angle decreased with the increasing of the content of PEG. It shows the superhydrophilicity properties for the films with the 0.8 g of PEG annealed at 750°C. This demonstrates that the annealed temperature and the addition of PEG affect the phase composition and the hydrophilicity properties of the films.

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Effect of polyethylene glycol and sodium dodecyl sulphate on microstructure and self-cleaning properties of graphene oxide/TiO2 thin film

2020-09-01 , Azani A. , Dewi Suriyani Che Halin , Kamrosni Abdul Razak , Mohd. Mustafa Al Bakri Abdullah , Norsuria Mahmed , Muhammad Mahyiddin Ramli , Mohd Arif Anuar Mohd Salleh , Mohd Fairul Sharin Abdul Razak , Ayu Wazira Azhari , Chobpattana V. , Kaczmarek L.

In this study, a sol gel procedure for preparation of TiO2 thin films with graphene oxide (GO) was developed. The effect of PEG and SDS addition on the microstructure of the films as well as the photocatalytic activity of the thin film was also investigated. The morphology and surface structure of the films were studied by SEM and AFM while the photocatalytic activity of the films was analyzed by measuring the degradation of methylene blue under sunlight irradiation using UV-Vis spectrophotometer. It was found that GO/TiO2 thin film with PEG shows a smaller and porous particle while GO/TiO2 thin film with SDS formed a very smooth surface and very fine particles. Therefore, in AFM analysis reveals that surface roughness decreases with the addition of PEG and SDS. Finally, the photocatalytic activity showed that GO/TiO2 thin film with SDS have the most effective self-cleaning property which degrade 64% of methylene blue that act as model of contaminants.

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Recent Developments in Steelmaking Industry and Potential Alkali Activated Based Steel Waste: A Comprehensive Review

2022-03-01 , Ikmal Hakem Aziz , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Liew Yun Ming , Li L.Y. , Sandu A.V. , Vizureanu P. , Nemes O. , Mahdi S.N.

The steel industry is responsible for one-third of all global industrial CO2 emissions, putting pressure on the industry to shift forward towards more environmentally friendly production methods. The metallurgical industry is under enormous pressure to reduce CO2 emissions as a result of growing environmental concerns about global warming. The reduction in CO2 emissions is normally fulfilled by recycling steel waste into alkali-activated cement. Numerous types of steel waste have been produced via three main production routes, including blast furnace, electric arc furnace, and basic oxygen furnace. To date, all of the steel waste has been incorporated into alkali activation system to enhance the properties. This review focuses on the current developments over the last ten years in the steelmaking industry. This work also summarizes the utilization of steel waste for improving cement properties through an alkali activation system. Finally, this work presents some future research opportunities with regard to the potential of steel waste to be utilized as an alkali-activated material.

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Effect of peg doped on optical properties of Ag/TiO2 thin film

2020-01-01 , Razak K.A. , Halin D.S.C. , Azani A. , Mohd. Mustafa Al Bakri Abdullah , Mohd Arif Anuar Mohd Salleh , Mahmed N. , Azhari A.W. , Chobpattana V.

PEG doped Ag/TiO2 thin film was prepared by the sol-gel method through the hydrolysis of titanium tetraisopropoxide and silver nitrate solution. Various amount of PEG (0.05g – 0.20g) were added into the solution preparation to study the effect of PEG doped on the optical properties of the prepared thin films. Spin coating method was used to get uniform film on ITO glass substrate followed by annealing process for 1 hour. The obtained thin films were analysed using XRD, SEM and UVVis spectrophotometer. Anatase phase of TiO2 thin film were obtained for all prepared thin films. The addition of 0.15g of PEG shows a thin film with a series of a small, coarse and loose crystalline structures compared to the non-PEG thin film structure with a larger and compact structure. The increasing of PEG amount added led to the increasing of light absorption and decreasing of the band gap.

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