Khor Chu Yee
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Khor Chu Yee
Official Name
Khor, Chu Yee
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Yee, Khor Chu
Khor, Chu Yee
Khor, C. Y.
Yee, K. C
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Scopus Author ID
57193315174
Researcher ID
B-1541-2014

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A study on the effect of fin pitch variation on the thermal performance of a bus duct conductor

2023 , Mark Selvan , Mohd Sharizal Abdul Aziz , Kok Hwa Yu , Mohd Sharif Nurulakmal , Heng Pin Ong , Khor Chu Yee

The numerical results of this work provide an optimum design for a three-dimensional natural convection heat sink on the bus duct conductor's casing. The size of the fin pitch is regarded as a design variable. Using ANSYS FLUENT, a numerical model that closely resembles the experimental setup was created. The experimental data were compared to the IEC 60439-1 and IEC 60439-2 standards as a benchmark. Five potential fin pitch sizes (s1 = 1.0 mm, s2 = 1.5 mm, s3 = 2.0 mm, s4 = 3.0 mm, and s5 = 4.0 mm) were taken into consideration. It was shown that as the fin pitch gap size is reduced, the average surface temperature falls. According to the investigation, conduction resistance increased while convective resistance reduced as the fin pitch gap size grew. The overall heat resistance did, however, rise. The optimal fin pitch size, s1 = 1 mm, outperformed the other fin pitches in terms of thermal performance. The current numerical analysis expects an improved knowledge of the influence of fin pitch on a bus duct conductor's thermal performance.

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Publication

Thermal performance optimization for a tapered heat sink of bus bar conductor using definitive screening design

2025-02 , Mark Selvan , Mohd Sharizal Abdul Aziz , Khor Chu Yee , H.P. Ong , Mohd Remy Rozaini Mohd Arif Zainol , Nur Izzati Muhammad Nadzri

This study examines and optimizes four design parameters of a bus duct conductor's heat sink: fin pitch, fin height, fin thickness, and the number of fin valleys. Average surface temperature and Nusselt number are chosen as the thermal performance criterion of the heat sink. A Definitive Screening Design is employed as a statistical method to reduce the number of optimization runs required while minimizing the aliasing. The regression analysis, analysis of variance, main effect analysis and optimization are conducted to optimize the heat sink design parameter and its thermal performance. The current results provide an ideal heat sink design for the casing of bus duct conductors. A fin pitch of 4 mm, fin height of 6.5 mm, fin thickness of 1 mm, and six fin valleys are determined to be the most optimal combination of design parameters. The optimized responses' average surface temperature and Nusselt numbers are 72.05 °C and 21.59, respectively, with 2.97 % and 6.25 % deviation from the predicted values of the empirical equation. The experimental results are benchmarked against the IEC 60439-1 and IEC 60439-2 standards. The current analysis is expected to provide more insight into the impact of design factors on the thermal performance of a bus duct conductor.

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A study on the effect of the number of fin valleys on the thermal performance of a bus duct conductor

2023 , Mark Selvan , Mohd Sharizal Abdul Aziz , Kok Hwa Yu , Nurulakmal Mohd Sharif , Hengpin Ong , Khor Chu Yee , Wan Rahiman

This paper presents a finite volume-based simulation study on the effect of the fin valley's number on the thermal performance of a bus duct conductor. A numerical model that closely mimics the experimental setup was developed using ANSYS FLUENT. The experimental data were used as a benchmark and followed the IEC 61439-1/2 standards. Five fin valley numbers were considered: s1 =2, s2 =3, s3 =4, s4 =5 and s5 =6. It was determined that the average surface temperature decreased as the number of fin valleys increased. From the analysis, it was observed that as the number of fin valleys increased, convection heat transfer improved as a consequence of enhanced surface Nusselt number. The best number of fin valleys was s5 =6, exhibiting superior thermal performance over a lower number of fin valleys. This study is expected to provide a better understanding of the fin valley’s effects on the thermal performance of a bus duct conductor’s casing.

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