Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
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Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

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Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique

2024-12 , Juyana A. Wahab , Mohd Arif Anuar Mohd Salleh , Marliza Mostapha @ Zakaria , Muhammad Firdaus Mohd Nazeri , Nurul Aida Husna Mohd Mahayuddin , Siti Faqihah Roduan

The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.

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Effect of surface-modified copper substrate by photolithography on the solderability of lead-free solder alloy

2023-07 , Nurul Aida Husna Mohd Mahayuddin , Juyana A. Wahab , Siti Faqihah Roduan , Mohd Arif Anuar Mohd Salleh

Various modifications of copper substrates have been developed for soldering applications due to their promising properties. The present study aimed to investigate the effect of dimple micro-texture on a copper substrate surface on soldering. Photolithography technique was used to fabricate a dimple micro-texture onto copper substrate. After surface texturing, the copper substrate was reflowed with Sn–0.7Cu solder. The surface microstructural was determined using optical microscopy (OM), the 3D surface profiler, and visual tests. The spreading area of the Sn–0.7Cu solder and the copper substrate was also examined. In comparison with Sn-0.7Cu solder on textured surface, TD500 has larger spreading area as the diameter was large nearly equivalent to non-textured surface. However, Sn–0.7Cu textured substrate exhibits low spreading area than non-textured surface that is beneficial for solderability properties.

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