Flora Somidin
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Preferred name
Flora Somidin
Official Name
Flora, Somidin
Alternative Name
Somidin, F.
Somidin, Flora
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Scopus Author ID
54973802500
Researcher ID
GPF-4634-2022

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  • Publication
    Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging
    (IOP Publishing Ltd, 2022-01-24)
    Flora Somidin
    ;
    Bakar M.F.A.
    ;
    Razak N.R.A.
    A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.
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