Norainiza Saud
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Preferred name
Norainiza Saud
Official Name
Norainiza, Saud
Alternative Name
Saud, N.
Saud, Norainiza
Norainiza, S.
Main Affiliation
Scopus Author ID
56352953900
Researcher ID
AAE-7855-2019

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Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing

2021 , Nur Syahirah Mohamad Zaimi , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Mohd. Mustafa Al Bakri Abdullah , Norainiza Saud , Shayfull Zamree Abd. Rahim , Petrica Vizureanu , Mohd Izrul Izwan Ramli , Rita Mohd Said

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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The microstructure evolution and activation energy study of Cu₆Sn₅ and Cu₃Sn intermetallic compound layer of Sn-10Cu/Cu solder joint

2024-03 , Muhammad Amirul Aiman A. Ramlee , Rita Mohd Said , Nur Syahirah Mohamad Zaimi , Norainiza Saud

The electronic packaging industry is gradually moving away from lead solder to lead-free solder, which is more environmentally friendly. However, there is still work to be done to ensure that lead-free solder meets the demands and requirements of the latest technology. The present study demonstrates the analysis of the microstructure formation of Cu₆Sn₅ and Cu₃Sn intermetallic compound layers in Sn-10Cu/Cu solder joints. Therefore, the key objective of this research is to determine the growth rate and activation energy of the Cu₆Sn₅ and Cu₃Sn intermetallic compound layer of the Sn-10Cu/Cu solder joint. The investigation on the bulk solder microstructure which consists of Cu₆Sn₅ and Cu₃Sn intermetallic compound layer was carried out using Optical Microscope (OM), Scanning Electron Microscope (SEM) with EDX and ImageJ software. The IMC layer undergoes rapid growth with increasing aging temperature and duration and the two main IMC layers (Cu₆Sn₅ and Cu₃Sn) grew thicker. The growth kinetic solder joints for Sn-10Cu and Sn-0.7Cu are 22.44 kJ/mol and 31.20 kJ/mol, respectively. Hence, the findings from this study may offer useful information for the development of high-reliability solder joints in future applications.

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Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing

2021 , Nur Syahirah Mohamad Zaimi , Mohd Arif Anuar Mohd Salleh , Andrei Victor Sandu , Mohd. Mustafa Al Bakri Abdullah , Norainiza Saud , Shayfull Zamree Abd. Rahim , Petrica Vizureanu , Rita Mohd Said , Mohd Izrul Izwan Ramli

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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