Theses & Dissertations

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https://hdl.handle.net/20.500.14170/1590

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Browsing Theses & Dissertations by Subject "Adhesive bonding"
  • Publication
    Failure investigation of T-joint bonded with hysol E-214 HP under elevated temperature
    ( 2018)
    Nor Fatin Bahri
    Granulator fluidization bed is a main component of fertilizer granulator system for the fertilizer plant. In recent cases, welding joint is the regular joint that used to affix the perforated plate to its frame structure. However, this technique can lead to joining failure due to high operating temperature during the production process. This issue also caused the granulator to shut down and interrupted the fertilizer production process. Thus, the investigation of the present work was intended to develop an alternative joining technique by using adhesive bonding that can withstand the fertilizer production operating temperature. In general, adhesive bonding technique has shown its capability as an alternative to the conventional joining method such as riveting, welding and mechanical fastening in various applications. The adhesive used for structural application needs to exhibit high-temperature capabilities in order to maintain their mechanical properties for the intentional service temperature of 95 ℃. In addition, the adhesive needs to be strong enough to adhere the perforated plate. The aim of this research is to identify the mechanical properties of adhesive that has good temperature resistance while providing high bond strength to the adhesive T-joint. For this purpose, the effect of the adhesive thickness on the strength of adhesive T-joint at elevated temperatures was analysed. Additionally, the T-joint structure were modelled, simulated and analysed for stress assessment to predict the strength of adhesive T-joint at the various adhesive thickness. The tensile tests were conducted to obtain the mechanical properties of the adhesive (the Young’s modulus, the yield stress and the stress-strain curve) that was fabricated in the shape of bulk specimens. The temperature was set within the range of room temperature (RT) to 125 ℃. Five samples of the adhesive T joint with different adhesive thickness were also tensile tested using universal testing machine at elevated temperature to acquire the adhesive T-joint strength. Based from the experimental outcomes, 0.5-1.0 mm is an effective adhesive thickness of adhesive T-joint for temperature ranging from RT to 125 ℃. The highest T-joint strength of 1.500 MPa was obtained at RT would refer to all ranges of adhesive thicknesses. The T-joint strength was slightly decreased from RT until 100 ℃. However, the strengths reduced significantly at temperature 125 °C with the average value of 1.065 MPa. The presented results indicate that the temperature and adhesive thickness of T-joint are the key parameters that must be considered in the bonded joint design. The finite element prediction for T-joint strength is in good agreement with the experimental failure stress results. On this basis, it is recommended that this adhesive is significant to be applied in perforated plate in fluidization bed reactors. Further research could be undertaken to identify other factors which contribute to T-joint strength in order for selecting the best adhesive for application of perforated plate joining.