The utilization of Sn-Zn based solder on electronic product was only feasible if the corrosion performance of this solder was assured. To achieve this, micro-alloying eutectic Sn-9Zn with Al was proposed. The corrosion performance was evaluated by using potentiodynamic polarization in 1 M HCl at constant scan rate. The microstructure changes due to corrosion exposure was also investigated to further understand the corrosion behaviour changes due to additions of Al. Overall corrosion rate was reduced with the micro-alloying process. Refinement of Zn-rich phase was found to help in producing much lower corrosion current and better passivation film formation on the surface due to the additions of Al. This modification deemed promising and further work should be explored in the future.
