The thermal management in the electronic device or system using the heat sink is important to ensure the device or system operating under the allowable temperature. The present study aims to investigate the thermal characteristic (i.e., temperature distribution) of the various heat sink designs via computational fluid dynamics (CFD) analysis. The electronic cooling process of the heat sink is carried out via CFD software. The temperature distribution of the various heat sink designs (i.e., plate fin, circular pin fin and rectangular fin) was analyzed and compared. The CFD analysis revealed the plate fin heat sink has lowest temperature distribution on the fin region. High temperature distribution was observed on the pin fin heat sink. The non-uniform temperature distribution was attributed by the direction of inlet airflow, whereas the low temperature was found in the region that close to the inlet airflow. Thus, the research findings indicated the design of heat sink significantly affects the temperature distribution during the electronic cooling process.
