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Research Output and Publications
Center of Excellence Geopolymer & Green Technology (CeGeoGTech)
Conference Publications
A short review: properties of superconducting solder
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A short review: properties of superconducting solder
Journal
IOP Conference Series: Materials Science and Engineering
ISSN
1757-8981
1757-899X
Date Issued
2020
Author(s)
M.S. Chang
Universiti Malaysia Perlis
Mohd Arif Anuar Mohd Salleh
Universiti Malaysia Perlis
Dewi Suriyani Che Halin
Universiti Malaysia Perlis
DOI
10.1088/1757-899X/957/1/012059
Handle (URI)
https://iopscience.iop.org/article/10.1088/1757-899X/957/1/012059/pdf
https://iopscience.iop.org/article/10.1088/1757-899X/957/1/012059
https://iopscience.iop.org
https://hdl.handle.net/20.500.14170/14194
Abstract
Development of electronic devices were moving towards miniaturization, multifunction and increasingly specific service environment of solder interconnects, where this drive to the higher requirements on the solder properties. Without solder, it would be impossible to produce the infinite electronic devices that define the 21st century. Hence, solder is important in the design and engineering process. This review paper was summarized on the literature of the low-temperature solder systems for superconducting solder materials, which provide further theoretical basis for the study of superconducting solder of electronic and aerospace applications. Pb-Bi system is the most satisfactory solder as a superconducting solder, but due to the restrictions of the lead usage, so new Pb-free superconducting solder need to be invented. Of those Pb-free superconducting materials had been studied, the Sn-In-Bi ternary solder system show the greatest superconducting properties as compared to other Pb-free superconducting solder where TC = 6.9 K, HC2 (4.2 K) = 0.18 T and JC (4.2 K, 0.01 T) = 1.3 × 108 A/m2 respectively. © Published under licence by IOP Publishing Ltd.
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A short review Properties of superconducting solder.pdf (959.34 KB)
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Mar 5, 2026
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