Muhammad Mahyiddin Ramli
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Preferred name
Muhammad Mahyiddin Ramli
Official Name
Muhammad Mahyiddin, Ramli
Alternative Name
Ramli, Muhammad Mahyiddin
Ramli, M. Muhammad
Ramli, M. M.
Ramli, M.
Ramli, Muhammad Mahyidin
Mahyiddin Ramli, Mohd
Ramli, Muhammad M.
Main Affiliation
Scopus Author ID
55891565000
Researcher ID
AAH-1285-2021

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  • Publication
    Mesoporous Structure of Doped and Undoped PEG on Ag/TiO2 Thin Film
    ( 2019-08-14)
    Abdul Razak K.
    ;
    Dewi Suriyani Che Halin
    ;
    Azani A.
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Norsuria Mahmed
    ;
    Muhammad Mahyiddin Ramli
    ;
    Sepeai S.
    In this reaserch, photocatalyst silver titanium dioxide was doped and modified by Polyethylene Glycol (PEG). The purpose of the present study was to analyse the synthesized Ag/TiO2 thin film doped and undoped PEG. Ag/TiO2 thin films on silicon wafer have been prepared by sol-gel spin coating. The samples were characterized by Grazing Incidence X-ray diffraction (GIXRD), Field Emission Scanning Electron Microscopy (FESEM) and Atomic Force Microscope (AFM). The doped and undoped PEG Ag/TiO2 thin films showed a mesoporous TiO2 matrix which includes TiO2 crystallites of 10-20 nm in size and small Ag nanoparticles (white spots) with various sizes ranging from 10 to 30 nm. However, doped PEG Ag/TiO2 thin film showed the Ag nanoparticles became agglomerates but still remained roughly uniform on the surface.
  • Publication
    Effect of Ni on the suppression of sn whisker formation in Sn-0.7Cu solder joint
    ( 2021)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    ;
    Jitrin Chaiprapa
    The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
  • Publication
    Surface Modification of GO/TiO2 Thin Film by Sodium Dodecyl Sulphate for Photocatalytic Applications
    ( 2024-01-01)
    Azliza Azani
    ;
    Dewi Suriyani Che Halin
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Kamrosni Abdul Razak
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Muhammad Mahyiddin Ramli
    ;
    Vizureanu P.
    ;
    Mohd Fairul Sharin Abdul Razak
    ;
    Sandu A.V.
    ;
    Mohamad N.
    Photocatalyst material titanium dioxide (TiO2) and graphene oxide (GO) were used to improve the self-cleaning properties of thin films. The sol–gel spin-coating method was successfully used to synthesize GO/TiO2 thin films. Surface modification was applied to optimize the self-cleaning capabilities by adding several concentrations of sodium dodecyl sulfate (SDS) (0.1 w/v%, 0.2 w/v%, 0.3 w/v%, 0.4 w/v%, and 0.5 w/v%) to the parent solution. The synthesized thin films were investigated using scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray diffraction, UV-visible spectroscopy, water contact angle analysis, and photocatalytic analysis. The AFM and SEM images revealed that as the SDS amount increased, the particles became less agglomerated, and the roughness of the surface reduced from 2.54 × 102 nm to 0.83 × 102 nm. The wettability analysis showed that when SDS increased to 0.4 w/v%, the water contact angle dropped to 15.30°, implying that the thin film exhibits hydrophilic qualities. A decrease in the GO/TiO2 band gap was obtained linearly with the increase in SDS addition from 3.17 eV to 2.75 eV. Finally, the improvement of the surface coating and reduction of the band gap enhanced the photocatalytic activity, which degraded 78.97% of methylene blue, which was obtained by 0.4SDS.
      2
  • Publication
    The effect of GO/TiO2 thin film during photodegradation of methylene blue dye
    ( 2021-09-01)
    Azliza Azani
    ;
    Dewi Suriyani Che Halin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Fairul Sharin Abdul Razak
    ;
    Muhammad Mahyiddin Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Chobpattana V.
    Titanium (IV) isopropoxide (TTIP) was used to synthesize GO/TiO2 thin films using a sol-gel spin-coating method onto a glass substrate, undergoing an heat tretment at 350 °C. Several amounts of graphene oxide (GO) (0-20mg) were weighed into a sol solution of TiO2 to produce GO/TiO2 thin films. The thin film samples were characterized by X-ray diffraction (XRD) to analyze the samples’ phase and by scanning electron microscopy (SEM) to analyze the samples’ microstructure. Physical testing such as water contact angle (WCA) was analyzed using an optical microscope with J-Image software. In contrast, the optical band gap and photodegradation of methylene blue under sunlight irradiation of the thin film was analyzed using UV-VIS spectrophotometry. GO5 thin film sample showed low-intensity anatase phase formation, where the microstructure revealed a larger surface area with the addition of GO. WCA reveals that GO/TiO2 thin film exhibits super hydrophilic properties where the angle decreases from 37.83° to 4.11°. The optical result shows that GO has improved the absorption edges by expanding into visible regions. Moreover, due to the existence of GO 3.30 eV band gap energy of TiO2 decreases from to 3.18 eV obtained by GO5. The improved adsorption edge allows Ti3+, O2 and interstitial states to be formed in low valence states with energy underneath than in the TiO2 band gap. Therefore, the photodegradation of methylene blue (MB) dye increases from 48 % to 59 % in the GO/TiO2 thin film.
      4  1
  • Publication
    Synthesis of Zn/TiO2 Thin Films for Self-Cleaning Applications
    ( 2022-07-01)
    Dewi Suriyani Che Halin
    ;
    Abidin A.S.Z.
    ;
    Azani A.
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Kamrosni Abdul Razak
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Muhammad Mahyiddin Ramli
    ;
    Sandu A.V.
    ;
    Vizureanu P.
    ;
    Kaczmarek L.
    ;
    Garus S.
    ;
    Garus J.
    Titanium dioxide (TiO2) thin film has been widely used in semiconductor applications. The surface modification on TiO2 has been done by adding zinc (Zn) in order to improve surface wettability and enhance the photocatalysis efficiency for solar cell applications. Self-cleaning technology is very important to sustain the efficiency of the solar cell and reduce the cost of the maintenance of the solar cell. In this work, the sol–gel method was used due to the economic factor and its best efficiency. The sol–gel method is a wet chemical technique involving several steps, such as hydrolysis and polycondensation, gelation, aging, drying, densification, and crystallization. The X-Ray diffraction pattern shows that anatase and rutile phases were detected at 2θ = 36.3864◦. It was clearly seen at 4% Zn-doped TiO2 annealed at 400◦C that due to the increment of Zn concentration, the phase transformed from the anatase phase to the rutile phase at high temperature. The scanning electron microscope micrograph shows that Zn concentration affects grain size. The water contact angle produced when 4% Zn-doped TiO2 was annealed at 300◦C, was 18◦ — higher than in the sample of 4% Zn-doped TiO2 annealed at 400◦C. These results clearly showed that the dopant concentration and the annealing temperature influence the properties of TiO2 for a self-cleaning application.
      2
  • Publication
    Effect of polyethylene glycol and sodium dodecyl sulphate on microstructure and self-cleaning properties of graphene oxide/TiO2 thin film
    ( 2020-09-01)
    Azani A.
    ;
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norsuria Mahmed
    ;
    Muhammad Mahyiddin Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Fairul Sharin Abdul Razak
    ;
    Ayu Wazira Azhari
    ;
    Chobpattana V.
    ;
    Kaczmarek L.
    In this study, a sol gel procedure for preparation of TiO2 thin films with graphene oxide (GO) was developed. The effect of PEG and SDS addition on the microstructure of the films as well as the photocatalytic activity of the thin film was also investigated. The morphology and surface structure of the films were studied by SEM and AFM while the photocatalytic activity of the films was analyzed by measuring the degradation of methylene blue under sunlight irradiation using UV-Vis spectrophotometer. It was found that GO/TiO2 thin film with PEG shows a smaller and porous particle while GO/TiO2 thin film with SDS formed a very smooth surface and very fine particles. Therefore, in AFM analysis reveals that surface roughness decreases with the addition of PEG and SDS. Finally, the photocatalytic activity showed that GO/TiO2 thin film with SDS have the most effective self-cleaning property which degrade 64% of methylene blue that act as model of contaminants.
      1
  • Publication
    Effect of isothermal annealing on Sn whisker growth behavior of Sn0.7Cu0.05Ni solder joint
    ( 2023)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    ;
    Ioan Gabriel Sandu
    This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature.
      2  18
  • Publication
    Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint
    ( 2021)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    ;
    Jitrin Chaiprapa
    The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
      3  20
  • Publication
    The Effect of GO/TiO2 Thin Film During Photodegradation of Methylene Blue Dye
    ( 2021)
    Azliza Azani
    ;
    Dewi Suriyani Che Halin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Fairul Sharin Abdul Razak
    ;
    V Chobpattana
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    Titanium (IV) isopropoxide (TTIP) was used to synthesize GO/TiO2 thin films using a sol-gel spin-coating method onto a glass substrate, undergoing an heat tretment at 350 °C. Several amounts of graphene oxide (GO) (0-20mg) were weighed into a sol solution of TiO2 to produce GO/TiO2 thin films. The thin film samples were characterized by X-ray diffraction (XRD) to analyze the samples’ phase and by scanning electron microscopy (SEM) to analyze the samples’ microstructure. Physical testing such as water contact angle (WCA) was analyzed using an optical microscope with J-Image software. In contrast, the optical band gap and photodegradation of methylene blue under sunlight irradiation of the thin film was analyzed using UV-VIS spectrophotometry. GO5 thin film sample showed low-intensity anatase phase formation, where the microstructure revealed a larger surface area with the addition of GO. WCA reveals that GO/TiO2 thin film exhibits super hydrophilic properties where the angle decreases from 37.83° to 4.11°. The optical result shows that GO has improved the absorption edges by expanding into visible regions. Moreover, due to the existence of GO 3.30 eV band gap energy of TiO2 decreases from to 3.18 eV obtained by GO5. The improved adsorption edge allows Ti3+, O2 and interstitial states to be formed in low valence states with energy underneath than in the TiO2 band gap. Therefore, the photodegradation of methylene blue (MB) dye increases from 48 % to 59 % in the GO/TiO2 thin film.
      34  30
  • Publication
    Effect of isothermal annealing on Sn whisker growth behavior of Sn0.7Cu0.05Ni solder joint
    ( 2023)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    ;
    Ioan Gabriel Sandu
    This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature.
      3  11