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Flora Somidin
Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints
2022-01-24
,
Flora Somidin
,
Bakar M.F.A.
,
Razak N.R.A.
A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.
2022-01-24
,
Flora Somidin
,
Ilias N.F.N.
,
Zaimi N.S.M.
,
Ramli M.I.I.
,
Razak N.R.A.
This paper reports the effect of 1.0 wt.% fly ash (FA) geopolymer ceramic powder addition in Sn-3.0Ag-0.5Cu (SAC305, in wt.%) solder joint. Powder metallurgy route was used to fabricate the new composite solder. Solder balls were formed from the new composite solder and reflowed on Cu substrate. The effect of FA as ceramic reinforcement on the bulk microstructure and the interfacial intermetallic compound layer formation of solder joints were investigated under optical microscope. Microstructure observation showed that the β-Sn dendrite size was refined in SAC305-1.0FA/Cu bulk solder joint sample than that in the non-reinforced sample. The addition of FA geopolymer ceramic powder into the solder matrix also produced a thinner intermetallic compound layer.